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LM3S1968-EQC50-A2

Texas Instruments

LM3S1968-EQC50-A2 by Texas Instruments

LM3S1968-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features 52 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,809 parts In-Stock

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4,809

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Vyrian

USA . 3,572 parts In-Stock

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3,572

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Distributors (Availability)

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One Stop Electronics

USA . 1,095 parts In-Stock

1+ parts

$3.000

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1,095

$3.000

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AZTECH Wire

Italy . 608 parts In-Stock

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$6.687

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608

$6.687

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Parana Technologies

USA . 2,146 parts In-Stock

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$62.772

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2,146

$62.772

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DigiPath Technology Company

USA . 932 parts In-Stock

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$69.119

100+ parts

$63.590

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932

$69.119

$63.590

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ChromeModa Solutions

Germany . 1,475 parts In-Stock

1+ parts

$70.530

100+ parts

$57.835

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1,475

$70.530

$57.835

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IDEA Electronic Components Group

UK . 714 parts In-Stock

1+ parts

$70.530

100+ parts

$67.004

1k+ parts

$63.477

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714

$70.530

$67.004

$63.477

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Component Stockers USA

USA . 286 parts In-Stock

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$99.990

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286

$99.990

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Corphita

USA . 3,924 parts In-Stock

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3,924

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Microchip USA

USA . 484 parts In-Stock

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484

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Overview

Experience the innovation and reliability of Texas Instruments with the LM3S1968-EQC50-A2 microcontroller. This powerful device offers seamless integration and exceptional performance for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers unparalleled value and efficiency. Trust in Texas Instruments for cutting-edge technology that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making the product suitable for compact applications.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, ensuring stable performance and protection from overloading.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board, making the product ideal for compact designs.

Bit Size: 32

32-bit architecture provides high computing power and efficiency, making the product suitable for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Compatible with multiple standard power supplies, offering flexibility in power source selection for various applications.

No. of Terminals: 100

Ample terminals allow for versatile connectivity options, making the product suitable for a wide range of interfaces and peripherals.

Technical Specifications

Microcontrollers LM3S1968-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1968-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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