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LM3S1960-IQC50-A2

Texas Instruments

LM3S1960-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1960-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications with PWM(6), QEI(2), TIMER(4), WDT peripherals, operating at -40 to 85°C temperature range.

Median Price

$22.825

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,242 parts In-Stock

1+ parts

-

100+ parts

$18.260

1k+ parts

$16.340

10k+ parts

$15.380

1,242

-

$18.260

$16.340

$15.380

DigiKey

USA . 1,242 parts In-Stock

1+ parts

-

100+ parts

$24.030

1k+ parts

-

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1,242

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$24.030

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Verical

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$22.825

1k+ parts

$20.425

10k+ parts

$19.225

450

-

$22.825

$20.425

$19.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 20 parts In-Stock

1+ parts

$14.636

100+ parts

-

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20

$14.636

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Digiode

USA . 2,648 parts In-Stock

1+ parts

$16.758

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2,648

$16.758

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Vyrian

USA . 4,160 parts In-Stock

1+ parts

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4,160

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DigiKey Marketplace

USA . 1,242 parts In-Stock

1+ parts

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1,242

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

1+ parts

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20

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Dan-Mar Components

USA . 20 parts In-Stock

1+ parts

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,939 parts In-Stock

1+ parts

$15.876

100+ parts

-

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3,939

$15.876

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Parana Technologies

USA . 1,211 parts In-Stock

1+ parts

$15.898

100+ parts

-

1k+ parts

$16.252

10k+ parts

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1,211

$15.898

-

$16.252

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ChromeModa Solutions

Germany . 3,820 parts In-Stock

1+ parts

$17.863

100+ parts

$14.648

1k+ parts

-

10k+ parts

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3,820

$17.863

$14.648

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IDEA Electronic Components Group

UK . 1,741 parts In-Stock

1+ parts

$17.863

100+ parts

$16.970

1k+ parts

$16.077

10k+ parts

-

1,741

$17.863

$16.970

$16.077

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Microchip USA

USA . 2,247 parts In-Stock

1+ parts

$51.380

100+ parts

$50.650

1k+ parts

$50.280

10k+ parts

$49.910

2,247

$51.380

$50.650

$50.280

$49.910

Authorized Procurement Solutions

USA . 24,000 parts In-Stock

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24,000

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DigiPath Technology Company

USA . 2,016 parts In-Stock

1+ parts

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$16.105

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2,016

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$16.105

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GreenTree Electronics

Israel . 699 parts In-Stock

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699

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Overview

Experience the power of innovation with the LM3S1960-IQC50-A2 microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and performance. With integrated cache, advanced peripherals, and low power mode, this microcontroller provides exceptional benefits and advantages to help you bring your projects to life. Elevate your designs with the LM3S1960-IQC50-A2 and unleash your creativity today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for portable and rugged applications.

Integrated Cache: YES

The integrated cache helps improve the performance of the microcontroller by storing frequently accessed data, reducing the need for fetching data from external memory.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75 V, this microcontroller is suitable for low power applications, helping to conserve energy and extend battery life.

ROM Words: 262144

The large ROM size allows for storing a significant amount of program code or firmware, making it suitable for applications that require a complex algorithm or multiple functions.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its high performance and energy efficiency, making this microcontroller a good choice for applications that require fast processing speed and low power consumption.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows the microcontroller to interface with analog sensors or signals, enabling a wide range of sensing applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller, it executes instructions quickly and efficiently, making it suitable for real-time applications or tasks that require high-speed processing.

Connectivity: I2C(2), SSI(2), UART(3)

The multiple connectivity options provide flexibility in interfacing with various devices or peripherals, enhancing the microcontroller's versatility in system integration.

Technical Specifications

Microcontrollers LM3S1960-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SSI(2), UART(3)

Peripherals:

PWM(6), QEI(2), TIMER(4), WDT

Trade Compliance

LM3S1960-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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