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LM3S1918-IQC50-A2

Texas Instruments

LM3S1918-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1918-IQC50-A2 is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 64 RAM words. It features 8 ADC channels, 5 timers, and PWM channels for industrial applications requiring low power mode and connectivity via I2C, IRDA, SSI, and UART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,415 parts In-Stock

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Digiode

USA . 4,877 parts In-Stock

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4,877

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Distributors (Availability)

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AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$6.663

100+ parts

-

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509

$6.663

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One Stop Electronics

USA . 841 parts In-Stock

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$23.000

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-

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841

$23.000

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Parana Technologies

USA . 1,190 parts In-Stock

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$33.227

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$121.141

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1,190

$33.227

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$121.141

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DigiPath Technology Company

USA . 33 parts In-Stock

1+ parts

$36.587

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$33.660

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33

$36.587

$33.660

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IDEA Electronic Components Group

UK . 1,677 parts In-Stock

1+ parts

$37.334

100+ parts

$35.467

1k+ parts

$33.601

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1,677

$37.334

$35.467

$33.601

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ChromeModa Solutions

Germany . 270 parts In-Stock

1+ parts

$37.334

100+ parts

$30.614

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270

$37.334

$30.614

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$55.525

100+ parts

$50.528

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$45.530

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500

$55.525

$50.528

$45.530

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Microchip USA

USA . 1,450 parts In-Stock

1+ parts

$60.600

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$59.540

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$59.020

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$58.490

1,450

$60.600

$59.540

$59.020

$58.490

Lixinc

USA . 15,108 parts In-Stock

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Corphita

USA . 4,005 parts In-Stock

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Overview

Discover the cutting-edge LM3S1918-IQC50-A2 microcontroller by Texas Instruments, a top-tier manufacturer renowned for its quality and innovation. This powerful device offers unmatched performance and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers value, efficiency, and seamless connectivity. Stay ahead of the competition with the LM3S1918-IQC50-A2 and experience the unparalleled benefits it brings to your projects. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good protection and insulation.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the microcontroller by storing frequently accessed data.

Maximum Supply Voltage: 2.75 V

Allows for flexibility in power supply options while still operating within safe voltage limits.

On Chip Data RAM Width: 8

Provides a good balance between memory storage capacity and speed for data processing.

Package Shape: SQUARE

Square packages are often easier to handle and mount on circuit boards compared to irregular shapes.

Bit Size: 32

A 32-bit microcontroller can handle larger chunks of data more efficiently than lower bit sizes.

No. of Terminals: 100

Having a higher number of terminals allows for more I/O connections and flexibility in circuit design.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Having Analog to Digital Converters onboard allows for the direct interfacing with analog sensors and signals.

ROM Words: 262144

With a large ROM capacity, the microcontroller can store and execute more complex programs and algorithms.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and energy efficiency for embedded systems.

No. of Serial I/Os: 2

Having multiple Serial I/O ports enables communication with other devices using serial protocols.

Technical Specifications

Microcontrollers LM3S1918-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

64

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA, SSI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(2), POR, TIMER(5), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1918-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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