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LM3S1850-EQC50-A2

Texas Instruments

LM3S1850-EQC50-A2 by Texas Instruments

LM3S1850-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it offers 56 I/O lines for industrial applications requiring a temperature range from -40 to 105 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,762 parts In-Stock

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5,762

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Digiode

USA . 4,532 parts In-Stock

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4,532

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Distributors (Availability)

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AZTECH Wire

Italy . 196 parts In-Stock

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$13.583

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196

$13.583

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One Stop Electronics

USA . 926 parts In-Stock

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$24.000

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926

$24.000

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Parana Technologies

USA . 1,514 parts In-Stock

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$63.704

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$63.704

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IDEA Electronic Components Group

UK . 1,604 parts In-Stock

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$71.577

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$67.998

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$64.419

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1,604

$71.577

$67.998

$64.419

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ChromeModa Solutions

Germany . 625 parts In-Stock

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$71.577

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$58.693

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625

$71.577

$58.693

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DigiPath Technology Company

USA . 599 parts In-Stock

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$64.534

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599

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$64.534

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Corphita

USA . 471 parts In-Stock

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Microchip USA

USA . 238 parts In-Stock

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Overview

Elevate your projects with the LM3S1850-EQC50-A2 microcontroller by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a reliable solution for a wide range of applications in the microcontroller category. This versatile device offers unmatched value, providing customers with enhanced performance, efficiency, and flexibility. Whether you're designing consumer electronics, industrial automation systems, or IoT devices, the LM3S1850-EQC50-A2 is sure to exceed your expectations and bring your ideas to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the microcontroller from external elements, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and making the assembly process more efficient.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75 V, this microcontroller can operate efficiently without the risk of damage from overvoltage.

Package Shape: SQUARE

The square package shape provides uniformity and easy integration into electronic devices, ensuring a sleek and compact design.

Bit Size: 32

A 32-bit architecture allows for faster and more efficient processing of data, making this microcontroller suitable for high-performance applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in designing circuits and systems with different power requirements.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with other components, peripherals, and sensors in a complex system.

Package Style (Meter): FLATPACK

The flatpack package style ensures easy mounting and secure connections, enhancing the overall reliability of the microcontroller.

Minimum Supply Voltage: 2.25 V

With a minimum supply voltage of 2.25 V, this microcontroller can operate efficiently even under low power conditions, making it suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C makes this microcontroller suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in harsh environmental conditions, such as extreme cold.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring stable connections and long-term reliability in electronic assemblies.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and devices, expanding its capability to process real-world data.

Terminal Position: QUAD

Quad terminal position offers easy alignment and soldering during assembly, reducing the chances of misalignment and ensuring a secure connection.

ROM Words: 262144

With 262144 ROM words, this microcontroller offers ample memory for storing program instructions and data, enabling complex algorithms to be executed efficiently.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for slim and compact design integration, ideal for space-constrained applications.

Width: 14 mm

A width of 14 mm provides a compact form factor, making this microcontroller suitable for applications where space is limited.

Maximum Clock Frequency: 0.032 MHz

A maximum clock frequency of 0.032 MHz enables fast execution of instructions, ensuring high-speed operation for time-critical applications.

Length: 14 mm

The length of 14 mm complements the width and seated height, contributing to a compact and space-efficient overall package.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliable performance in rugged environments with wide temperature variations and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring RISC architecture, this microcontroller offers efficient instruction execution and low power consumption, making it suitable for battery-operated devices.

RAM Bytes: 32768

With 32768 bytes of RAM, this microcontroller provides sufficient memory for temporary data storage and quick access, enhancing its multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form simplifies surface mounting and soldering processes, ensuring secure connections and reliable operation in electronic circuits.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V provides stable power delivery to the microcontroller, ensuring consistent performance and preventing voltage-related issues.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of voltage levels and pulse widths, making this microcontroller suitable for motor control and analog signal processing.

ROM Programmability: FLASH

Featuring Flash ROM programmability, this microcontroller allows for easy reprogramming of firmware and software updates, enhancing flexibility and future-proofing capabilities.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller offers fine-pitch connections for high-density circuit boards, maximizing connectivity options in compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this microcontroller is moisture sensitive and requires proper handling during assembly and storage to prevent damage from humidity exposure.

Speed: 50 rpm

With a speed rating of 50 rpm, this microcontroller can process instructions and data at a high speed, making it suitable for real-time control applications that require quick response times.

No. of I/O Lines: 56

Having 56 Input/Output (I/O) lines provides ample connectivity for interfacing with external devices, sensors, and peripherals, making this microcontroller versatile and adaptable to various applications.

Technical Specifications

Microcontrollers LM3S1850-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1850-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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