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LM3S1816-IQR50-C5

Texas Instruments

LM3S1816-IQR50-C5 by Texas Instruments

LM3S1816-IQR50-C5 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16.384 MHz. It features 32768 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,289 parts In-Stock

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Digiode

USA . 2,102 parts In-Stock

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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ComSIT USA

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 399 parts In-Stock

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$5.207

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399

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One Stop Electronics

USA . 290 parts In-Stock

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$27.000

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Parana Technologies

USA . 1,649 parts In-Stock

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$68.845

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DigiPath Technology Company

USA . 1,802 parts In-Stock

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$75.807

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$69.742

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$75.807

$69.742

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ChromeModa Solutions

Germany . 3,519 parts In-Stock

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$77.354

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$63.430

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IDEA Electronic Components Group

UK . 1,805 parts In-Stock

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$77.354

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$73.486

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$69.619

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1,805

$77.354

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$69.619

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Lixinc

USA . 6,397 parts In-Stock

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Corphita

USA . 4,415 parts In-Stock

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Microchip USA

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Overview

Step into the world of cutting-edge technology with the LM3S1816-IQR50-C5 by Texas Instruments. Crafted with precision and expertise, this microcontroller is designed to deliver exceptional performance in a variety of applications. Whether you're a tech enthusiast, hobbyist, or professional, this product offers unmatched value and benefits. From its high-quality construction to its advanced features, the LM3S1816-IQR50-C5 is your gateway to seamless operation and innovation. Upgrade your projects today and experience the advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V ensures safe operation and prevents potential damage to the microcontroller.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, optimizing layout and design.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance for complex applications and tasks.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) offers flexibility in design and compatibility with different power sources.

No. of Terminals: 64

With 64 terminals, this microcontroller enables connectivity to a variety of external components and peripherals for expanded functionality.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235 V ensures stable operation even under low power conditions, extending the device's usable range.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for reliable performance in demanding industrial environments with elevated temperatures.

CPU Family: CORTEX-M3

Utilizing the Cortex-M3 CPU family offers high performance and efficiency, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in cold environments or during startup in suboptimal conditions.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides excellent solderability and reliability in assembly processes, contributing to overall product quality.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion, allowing the microcontroller to interface with various sensors and inputs.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency, enabling fast and seamless communication between peripherals and memory.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and connections, improving signal integrity and reducing the risk of errors.

ROM Words: 262144

Large ROM capacity of 262144 words provides ample storage for program code and data, accommodating complex software requirements.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm helps in compact design and reduces overall profile, making it suitable for space-constrained applications.

Width: 10 mm

Compact width of 10mm allows for efficient placement on the PCB, optimizing board space utilization and component layout.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency of 16.384 MHz enables swift execution of instructions and operations, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures proper soldering without damaging the microcontroller during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and secure attachment to the PCB during manufacturing processes.

Length: 10 mm

Compact length of 10mm contributes to a small form factor, making the microcontroller suitable for compact devices and space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures robust performance in harsh operating environments, meeting the reliability demands of industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being designed as a microcontroller specifically for peripherals, this product offers extensive interfacing capabilities for connecting external devices and components.

RAM Bytes: 32768

Generous RAM capacity of 32768 bytes supports efficient data storage and manipulation, enabling smooth operation of applications with large memory requirements.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast operation, contributing to energy-efficient and reliable performance.

Terminal Form: GULL WING

Gull wing terminal form allows for secure solder joints and reliable connections, enhancing the overall durability and longevity of the microcontroller.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage of 1.3V ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations and potential malfunctions.

PWM Channels: YES

Availability of PWM channels enables precise control of analog outputs, allowing for efficient management of motor speed, LED brightness, and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware and software, ensuring adaptability and future-proofing of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and compact design, enhancing the integration capabilities of the microcontroller.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates that the microcontroller has a moderate sensitivity to moisture exposure during storage or assembly, requiring appropriate handling to prevent damage.

Speed: 50 rpm

The speed of 50 revolutions per minute (rpm) indicates the rotation rate for specific applications, providing precise control and operation in motor control and timing tasks.

No. of I/O Lines: 33

With 33 I/O lines, the microcontroller offers versatile connectivity options for interfacing with external devices, sensors, and peripherals, expanding the scope of applications and functionality.

Technical Specifications

Microcontrollers LM3S1816-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1816-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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