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LM3S1816-IQR50-C1T

Texas Instruments

LM3S1816-IQR50-C1T by Texas Instruments

Texas Instruments LM3S1816-IQR50-C1T microcontroller features 32-bit architecture, 64 terminals, and 262144 ROM words. Ideal for industrial applications, it offers ADC and DMA channels, with a clock frequency of 0.032 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,119 parts In-Stock

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7,119

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Digiode

USA . 4,740 parts In-Stock

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4,740

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Distributors (Availability)

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AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$14.577

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286

$14.577

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One Stop Electronics

USA . 1,249 parts In-Stock

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$29.000

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1,249

$29.000

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Parana Technologies

USA . 1,528 parts In-Stock

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$47.075

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1,528

$47.075

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DigiPath Technology Company

USA . 1,478 parts In-Stock

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$51.835

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1,478

$51.835

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ChromeModa Solutions

Germany . 4,836 parts In-Stock

1+ parts

$52.893

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$43.372

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4,836

$52.893

$43.372

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IDEA Electronic Components Group

UK . 1,572 parts In-Stock

1+ parts

$52.893

100+ parts

$50.248

1k+ parts

$47.604

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1,572

$52.893

$50.248

$47.604

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Corphita

USA . 1,862 parts In-Stock

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Microchip USA

USA . 222 parts In-Stock

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Overview

Experience the cutting-edge technology of the LM3S1816-IQR50-C1T microcontroller from Texas Instruments. This high-quality device offers unparalleled performance and reliability, making it perfect for a wide range of applications. With advanced features like ADC and DMA channels, PWM capabilities, and a powerful 32-bit architecture, this microcontroller is designed to meet all your project needs. Trust in Texas Instruments' reputation for excellence and innovation, and unlock endless possibilities with the LM3S1816-IQR50-C1T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of PCBs, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V offers compatibility with a wide range of power sources, providing flexibility in design.

Package Shape: SQUARE

The square package shape allows for more efficient use of PCB space, making it suitable for compact designs.

Bit Size: 32

The 32-bit size enhances processing power and capabilities, suitable for applications requiring high performance.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) offers compatibility with various components and power sources.

No. of Terminals: 64

With 64 terminals, the microcontroller can be easily connected to external components, expanding its functionality.

Package Style (Meter): FLATPACK

The flatpack style provides a low profile design, making it suitable for applications where space is limited.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage of 1.08 V allows for efficient power usage and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation in industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) allows the microcontroller to function in extreme temperature conditions without any issues.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data, making it suitable for sensor interfacing and measurement applications.

DMA Channels: YES

DMA channels facilitate direct memory access, enhancing data transfer speed and efficiency in high-performance applications.

Terminal Position: QUAD

The quad terminal position allows for easy connections and soldering onto PCBs, simplifying the manufacturing process.

ROM Words: 262144

With 262144 ROM words, the microcontroller offers ample storage space for firmware and program code, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm saves space on the PCB and enables compact designs in space-constrained applications.

Width: 10 mm

A width of 10 mm provides a compact form factor, making it suitable for applications where space is limited.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz allows for fast execution of instructions, essential for real-time processing applications.

Length: 10 mm

A length of 10 mm contributes to the overall compact design of the microcontroller, suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation even in harsh industrial environments with extreme temperatures.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripheral ICs integrated, it offers a complete solution for embedded control applications.

RAM Bytes: 32768

With 32768 RAM bytes, the microcontroller provides sufficient memory for data storage and manipulation, suitable for multitasking applications.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, high noise immunity, and faster operation, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process, providing strong and reliable connections to the PCB for enhanced durability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V provides stable power to the microcontroller, ensuring consistent performance in various operating conditions.

PWM Channels: YES

With PWM channels, the microcontroller can generate precise analog output signals, making it suitable for controlling motors, LEDs, and other devices.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick reprogramming of the microcontroller, offering flexibility in firmware updates and modifications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the microcontroller allows for dense packing and high interconnect density on the PCB, saving space and improving signal integrity.

Speed: 50 rpm

With a speed of 50 rpm, the microcontroller can process instructions quickly, ensuring responsive performance in time-critical applications.

No. of I/O Lines: 33

Having 33 I/O lines allows for versatile connectivity and interfacing with external devices, making the microcontroller suitable for a wide range of applications.

Technical Specifications

Microcontrollers LM3S1816-IQR50-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1816-IQR50-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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