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LM3S1811-IQC50-C5T

Texas Instruments

LM3S1811-IQC50-C5T by Texas Instruments

LM3S1811-IQC50-C5T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Operating at a max clock frequency of 16 MHz, it features ADC and DMA channels for industrial applications requiring high-speed processing and precise data acquisition. With a package style of FLATPACK and GULL WING terminal form, this Cortex-M3 CPU family device is suitable for compact designs where space-saving is crucial.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,441 parts In-Stock

1+ parts

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5,441

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Digiode

USA . 2,597 parts In-Stock

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2,597

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Distributors (Availability)

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AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$12.987

100+ parts

-

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224

$12.987

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One Stop Electronics

USA . 929 parts In-Stock

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$19.000

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929

$19.000

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Parana Technologies

USA . 962 parts In-Stock

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$69.529

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962

$69.529

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IDEA Electronic Components Group

UK . 2,123 parts In-Stock

1+ parts

$78.122

100+ parts

$74.216

1k+ parts

$70.310

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-

2,123

$78.122

$74.216

$70.310

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ChromeModa Solutions

Germany . 1,874 parts In-Stock

1+ parts

$78.122

100+ parts

$64.060

1k+ parts

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1,874

$78.122

$64.060

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Corphita

USA . 2,251 parts In-Stock

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2,251

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DigiPath Technology Company

USA . 1,487 parts In-Stock

1+ parts

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$70.435

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1,487

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$70.435

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Microchip USA

USA . 304 parts In-Stock

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304

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Overview

Elevate your projects with the LM3S1811-IQC50-C5T by Texas Instruments, a top-of-the-line microcontroller designed for peak performance and reliability. Crafted with precision and expertise, this product offers unparalleled value with its advanced features and versatile applications. Whether you're delving into IoT devices or robotics, this powerhouse chip with its cutting-edge technology and robust design ensures seamless functionality and efficiency. Trust in Texas Instruments to deliver exceptional quality and innovation, setting you up for success every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Enables easy mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power requirements for different applications.

Bit Size: 32

Offers a high number of bits for processing data, enhancing the performance and processing capabilities of the microcontroller.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components and peripherals in a system.

CPU Family: CORTEX-M3

Features a powerful and efficient Cortex-M3 CPU, ensuring reliable and high-performance processing for various tasks.

RAM Bytes: 32768

Offers a generous amount of random access memory for storing data and variables during operation, enhancing the microcontroller's functionality.

ROM Words: 262144

Provides a large amount of programmable memory, allowing for extensive code storage and application versatility.

Maximum Clock Frequency: 16 MHz

Supports a high clock frequency for rapid data processing and real-time operations, making it suitable for demanding applications.

Technical Specifications

Microcontrollers LM3S1811-IQC50-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1811-IQC50-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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