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LM3S1811-IQC50-C5

Texas Instruments

LM3S1811-IQC50-C5 by Texas Instruments

Texas Instruments LM3S1811-IQC50-C5 is a 32-bit microcontroller with Cortex-M3 CPU, 262144 ROM words, and 32768 RAM bytes. Operating at up to 16 MHz with 67 I/O lines, it's ideal for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range of -40 to 85°C, this microcontroller offers reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 4,351 parts In-Stock

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4,351

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Vyrian

USA . 3,335 parts In-Stock

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Digiode

USA . 1,357 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 982 parts In-Stock

1+ parts

$6.000

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982

$6.000

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AZTECH Wire

Italy . 321 parts In-Stock

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$17.406

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321

$17.406

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Parana Technologies

USA . 1,619 parts In-Stock

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$40.705

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$40.705

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DigiPath Technology Company

USA . 96 parts In-Stock

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$44.821

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96

$44.821

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ChromeModa Solutions

Germany . 6,467 parts In-Stock

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$45.736

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$37.504

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6,467

$45.736

$37.504

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IDEA Electronic Components Group

UK . 1,018 parts In-Stock

1+ parts

$45.736

100+ parts

$43.449

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$41.162

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1,018

$45.736

$43.449

$41.162

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 6,160 parts In-Stock

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Corphita

USA . 4,754 parts In-Stock

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A-Z Elektronik GmbH

Germany . 900 parts In-Stock

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900

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Microchip USA

USA . 173 parts In-Stock

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Kepictronics

USA . 88 parts In-Stock

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Overview

Discover the LM3S1811-IQC50-C5 by Texas Instruments, a top-quality microcontroller designed to meet your application needs. With a 32-bit Cortex-M3 CPU family and impressive features like ADC channels, DMA channels, and PWM channels, this product offers exceptional performance and versatility. Whether you're working on industrial automation, consumer electronics, or IoT devices, the LM3S1811-IQC50-C5 provides reliable operation and efficient power management with its wide supply voltage range. Trust in Texas Instruments' reputation for excellence and innovation, and unlock new possibilities for your projects with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape facilitates easy placement on the PCB and efficient use of board space.

Bit Size: 32

32-bit architecture enables high-performance computing and efficient data processing.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and low-profile design, suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures stable operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand elevated temperatures in industrial environments.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family provides efficient processing capabilities for embedded applications requiring high performance.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can function reliably in extreme cold environments.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion, expanding the range of input signals the microcontroller can handle.

DMA Channels: YES

Integrated DMA channels allow for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and assembly on the PCB, simplifying manufacturing processes.

ROM Words: 262144

The large ROM capacity of 262144 words provides ample storage for program instructions and data.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm enables compact and slim device designs, ideal for space-constrained applications.

Width: 14 mm

With a width of 14mm, the microcontroller can fit into narrow spaces and compact layouts on the PCB.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16MHz allows for high-speed operation and rapid data processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

With a peak reflow temperature time of 30 seconds, the microcontroller can withstand reflow soldering processes efficiently.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260°C offers robust solder joint reliability during assembly processes.

Length: 14 mm

A length of 14mm allows for flexible placement and easy integration into various device designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral IC types ensures efficient and optimized control and data processing capabilities.

RAM Bytes: 32768

With 32768 bytes of RAM, the microcontroller can efficiently store and process data during program execution.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making the microcontroller energy-efficient and robust.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and assembly processes, ensuring secure connections and reliable operation.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V provides stable and consistent power delivery for optimal performance and reliability.

PWM Channels: YES

Support for PWM channels allows for precise control of motor speeds, LED brightness, and other analog output applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible updating of firmware and software, enhancing the versatility and longevity of the device.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microcontroller offers high-density interconnect options for compact and space-efficient PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures safe handling and storage of the microcontroller during PCB assembly processes, reducing the risk of moisture-related damage.

Speed: 50 rpm

The speed capability of 50 revolutions per minute supports applications requiring precise timing and control, such as motor control and robotics.

No. of I/O Lines: 67

Having 67 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LM3S1811-IQC50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1811-IQC50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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