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LM3S1811-IQC50-C1T

Texas Instruments

LM3S1811-IQC50-C1T by Texas Instruments

Texas Instruments LM3S1811-IQC50-C1T is a 32-bit microcontroller with 262144 ROM words, 32768 RAM bytes, and max clock frequency of 16.384 MHz. Ideal for industrial applications, it features ADC and DMA channels, BOR, PWM, RTC, and UART connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,497 parts In-Stock

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7,497

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Digiode

USA . 4,369 parts In-Stock

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4,369

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Distributors (Availability)

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AZTECH Wire

Italy . 785 parts In-Stock

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$7.082

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785

$7.082

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One Stop Electronics

USA . 1,419 parts In-Stock

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$27.000

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Parana Technologies

USA . 2,098 parts In-Stock

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$51.259

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$51.259

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ChromeModa Solutions

Germany . 6,025 parts In-Stock

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$57.594

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$47.227

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6,025

$57.594

$47.227

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IDEA Electronic Components Group

UK . 1,320 parts In-Stock

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$57.594

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$54.714

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$51.835

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1,320

$57.594

$54.714

$51.835

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QUARKTWIN TECHNOLOGY LTD

USA . 21,113 parts In-Stock

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Microchip USA

USA . 5,585 parts In-Stock

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Corphita

USA . 1,967 parts In-Stock

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DigiPath Technology Company

USA . 601 parts In-Stock

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$51.927

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601

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Overview

Unlock the power of innovation with the LM3S1811-IQC50-C1T microcontroller by Texas Instruments. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller is designed to exceed expectations. Experience seamless connectivity, efficient power management, and advanced features that will take your projects to the next level. Trust in Texas Instruments to deliver superior quality and value with the LM3S1811-IQC50-C1T microcontroller. Elevate your designs and embrace limitless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.32 V

Provides efficient power management and ensures safe operation within specified voltage limits.

Package Shape: SQUARE

Compact shape for space-efficient integration into various electronic devices.

Bit Size: 32

High-bit size for processing complex algorithms and data efficiently.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply options allows flexibility in system design and compatibility.

No. of Terminals: 100

Sufficient number of terminals for connecting various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Versatile package styles for different mounting and space constraints in electronic designs.

Minimum Supply Voltage: 1.08 V

Provides a range of supply voltage options for power optimization and management.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications requiring extended operating temperature range.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ideal for outdoor and harsh environment use.

ADC Channels: YES

Analog to Digital Converters enable measurement and conversion of analog signals for precise data processing.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing without CPU intervention.

Terminal Position: QUAD

Quad terminal position for easy mounting and secure connection on PCB.

ROM Words: 262144

Large ROM capacity for storing program instructions and data in non-volatile memory.

Maximum Seated Height: 1.6 mm

Low profile design for compact and space-saving installation in electronic devices.

Width: 14 mm

Compact width for fitting into narrow spaces and dense PCB layouts.

Peripherals: BOR, COMPARATOR(2), DMA(32), POR, PWM, RTC, TIMER(9), WDT(2)

Wide range of built-in peripherals for enhanced functionality and application versatility.

Maximum Clock Frequency: 16.384 MHz

High clock frequency for fast and efficient data processing and system performance.

Length: 14 mm

Compact length for space-efficient integration and layout design in electronic products.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environmental conditions.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology for low power consumption, high speed, and reliability.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure connection on PCB.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple channels and high resolution ADCs for accurate analog signal conversion.

Nominal Supply Voltage: 1.2 V

Stable and reliable supply voltage for consistent performance and power efficiency.

PWM Channels: YES

Pulse Width Modulation channels for precise control of output signals and motor speed.

Connectivity: I2C(2), SSI(2), UART(3)

Multiple connectivity options for interfacing with external devices and communication protocols.

ROM Programmability: FLASH

Flash programmable ROM for easy firmware updates and reprogramming capabilities.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing for compact design and high-density mounting on PCB.

Speed: 50 rpm

High-speed performance for real-time processing and responsive system operation.

On Chip Program ROM Width: 8

Wide ROM data bus width for fast access and retrieval of program instructions.

No. of I/O Lines: 67

Sufficient I/O lines for interfacing with external peripherals and sensors in the system.

Technical Specifications

Microcontrollers LM3S1811-IQC50-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Data EEPROM Size:

0

Connectivity:

I2C(2), SSI(2), UART(3)

Peripherals:

BOR, COMPARATOR(2), DMA(32), POR, PWM, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1811-IQC50-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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