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LM3S1751-IQC50-A2T

Texas Instruments

LM3S1751-IQC50-A2T by Texas Instruments

LM3S1751-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features 56 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,721 parts In-Stock

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Digiode

USA . 431 parts In-Stock

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Chip Stock

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One Stop Electronics

USA . 145 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 771 parts In-Stock

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Microchip USA

USA . 3,759 parts In-Stock

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$44.270

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$43.640

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$43.320

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Parana Technologies

USA . 891 parts In-Stock

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IDEA Electronic Components Group

UK . 559 parts In-Stock

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$73.355

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$69.687

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$66.020

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ChromeModa Solutions

Germany . 260 parts In-Stock

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Component Stockers USA

USA . 355 parts In-Stock

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Corphita

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DigiPath Technology Company

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Overview

Experience the superior quality and reliability of Texas Instruments with the LM3S1751-IQC50-A2T microcontroller. This powerful device offers a wide range of applications in various industries, providing customers with unmatched value and performance. Whether you're looking for efficient power management, precise ADC channels, or reliable PWM channels, this microcontroller has you covered. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the LM3S1751-IQC50-A2T and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

Optimal voltage level for stable and efficient operation of the microcontroller.

Package Shape: SQUARE

Square shape allows for easier placement and alignment on PCBs.

Bit Size: 32

32-bit architecture enables higher processing capabilities and performance.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 100

Sufficient number of terminals for versatile connectivity and functionality.

Package Style (Meter): FLATPACK

Flatpack style offers efficient heat dissipation and compact design.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions as well.

Terminal Finish: TIN

Tin finish provides good conductivity and solderability for reliable connections.

ADC Channels: YES

Integrated ADC channels enable analog signal processing for sensor interfacing.

Terminal Position: QUAD

Quad terminal position allows for better signal routing and minimizes interference.

ROM Words: 131072

Large ROM capacity for storing program codes and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact width for fitting into narrow spaces on PCBs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for 30 seconds during soldering processes.

Peak Reflow Temperature °C: 260

High temperature tolerance for reflow soldering without damage.

Length: 14 mm

Suitable length for compatibility with standard PCB layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and reduced power consumption.

RAM Bytes: 65536

Ample RAM capacity for temporary data storage during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical support and easy soldering.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

PWM channels for precise control of analog signals and motor speed.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of firmware and updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs and space efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard assembly processes.

Speed: 50 rpm

Supports applications requiring precise timing and speed control.

No. of I/O Lines: 56

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1751-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1751-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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