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LM3S1751-IQC50-A2

Texas Instruments

LM3S1751-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1751-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 131072 ROM words, and 65536 RAM bytes. Ideal for industrial applications with ADC channels, PWM(4), TIMER(3), and WDT peripherals. Operates at -40 to 85°C temperature range with low power mode and boundary scan capability.

Median Price

$18.740

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 540 parts In-Stock

1+ parts

$18.740

100+ parts

$18.370

1k+ parts

$17.990

10k+ parts

-

540

$18.740

$18.370

$17.990

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,186 parts In-Stock

1+ parts

$26.714

100+ parts

-

1k+ parts

-

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1,186

$26.714

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Vyrian

USA . 3,013 parts In-Stock

1+ parts

$28.120

100+ parts

-

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-

10k+ parts

-

3,013

$28.120

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 503 parts In-Stock

1+ parts

$13.720

100+ parts

-

1k+ parts

-

10k+ parts

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503

$13.720

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Parana Technologies

USA . 1,260 parts In-Stock

1+ parts

$17.799

100+ parts

-

1k+ parts

$17.978

10k+ parts

-

1,260

$17.799

-

$17.978

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DigiPath Technology Company

USA . 295 parts In-Stock

1+ parts

$19.599

100+ parts

$18.031

1k+ parts

-

10k+ parts

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295

$19.599

$18.031

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-

ChromeModa Solutions

Germany . 5,856 parts In-Stock

1+ parts

$19.999

100+ parts

$16.399

1k+ parts

-

10k+ parts

-

5,856

$19.999

$16.399

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IDEA Electronic Components Group

UK . 2,339 parts In-Stock

1+ parts

$19.999

100+ parts

$18.999

1k+ parts

$17.999

10k+ parts

-

2,339

$19.999

$18.999

$17.999

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Corphita

USA . 4,227 parts In-Stock

1+ parts

$25.308

100+ parts

-

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4,227

$25.308

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$27.531

100+ parts

$25.053

1k+ parts

$22.575

10k+ parts

-

2,500

$27.531

$25.053

$22.575

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Microchip USA

USA . 2,172 parts In-Stock

1+ parts

$70.770

100+ parts

$69.530

1k+ parts

$68.920

10k+ parts

$68.300

2,172

$70.770

$69.530

$68.920

$68.300

A-Z Elektronik GmbH

Germany . 116 parts In-Stock

1+ parts

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116

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Kepictronics

USA . 37 parts In-Stock

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37

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Overview

Unlock the power of cutting-edge technology with the LM3S1751-IQC50-A2 microcontroller by Texas Instruments. Designed with precision and expertise, this device offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller is your key to seamless integration and superior functionality. Experience the value of innovation with Texas Instruments and elevate your projects to new heights with the LM3S1751-IQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various environments and applications.

Integrated Cache: YES

The integrated cache enhances the performance of the microcontroller by reducing the access time to frequently used data, improving overall efficiency.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V allows for efficient power management and ensures the safety of the microcontroller during operation.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 CPU family, this microcontroller offers high performance and low power consumption, making it ideal for embedded systems and IoT applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, allowing for accurate measurements and sensor interfacing.

ROM Programmability: FLASH

ROM programmability using FLASH technology enables easy and efficient reprogramming of the microcontroller, allowing for flexibility in firmware updates and modifications.

Connectivity: I2C, SSI(2), UART(3)

Multiple connectivity options such as I2C, SSI, and UART make this microcontroller versatile and compatible with a wide range of communication protocols and devices.

Speed: 50 rpm

The speed of 50 rpm indicates the processing capability of the microcontroller, ensuring fast and efficient operation for various real-time applications.

Technical Specifications

Microcontrollers LM3S1751-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI(2), UART(3)

Peripherals:

PWM(4), TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S1751-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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