Loading...

LM3S1751-IBZ50-A2

Texas Instruments

LM3S1751-IBZ50-A2 by Texas Instruments

LM3S1751-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It features 4 ADC channels, 4 PWM peripherals, and connectivity options like I2C and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,117

-

-

-

-

Digiode

USA . 2,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,234

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$7.230

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$7.230

-

-

-

One Stop Electronics

USA . 521 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

521

$10.000

-

-

-

Parana Technologies

USA . 875 parts In-Stock

1+ parts

$25.744

100+ parts

-

1k+ parts

$26.351

10k+ parts

-

875

$25.744

-

$26.351

-

DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$28.347

100+ parts

$26.080

1k+ parts

-

10k+ parts

-

1,761

$28.347

$26.080

-

-

ChromeModa Solutions

Germany . 3,120 parts In-Stock

1+ parts

$28.926

100+ parts

$23.719

1k+ parts

-

10k+ parts

-

3,120

$28.926

$23.719

-

-

IDEA Electronic Components Group

UK . 1,653 parts In-Stock

1+ parts

$28.926

100+ parts

$27.480

1k+ parts

$26.033

10k+ parts

-

1,653

$28.926

$27.480

$26.033

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$44.953

100+ parts

$40.907

1k+ parts

$36.861

10k+ parts

-

2,500

$44.953

$40.907

$36.861

-

Component Stockers USA

USA . 223 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

223

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 14,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,839

-

-

-

-

Corphita

USA . 3,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,509

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Microchip USA

USA . 493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

493

-

-

-

-

Overview

Experience superior performance and reliability with the LM3S1751-IBZ50-A2 microcontroller by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers cutting-edge technology for various applications. This high-quality microcontroller offers exceptional value, providing customers with advanced features, low power consumption, and a wide range of peripherals such as PWM, timers, and ADC channels. Enhance your project with the LM3S1751-IBZ50-A2 and unlock endless possibilities in industrial-grade applications. Trust Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection to the internal components of the microcontroller.

Integrated Cache: YES

Cache memory improves the overall performance of the microcontroller by reducing access time to frequently used data and instructions.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, ensuring the reliability of the microcontroller.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage on the chip itself.

CPU Family: CORTEX-M3

Belonging to the Cortex-M3 family ensures compatibility with a wide range of software and development tools, making it a versatile choice for developers.

ADC Channels: YES

Analog to Digital Convertors enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to the microcontroller's firmware, enhancing flexibility and adaptability.

Connectivity: I2C, SSI(2), UART(3)

Multiple connectivity options enable easy integration with other devices and communication protocols, making it suitable for diverse applications.

Technical Specifications

Microcontrollers LM3S1751-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

6

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI(2), UART(3)

Peripherals:

PWM(4), TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S1751-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20