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LM3S1751-EQC50-A2

Texas Instruments

LM3S1751-EQC50-A2 by Texas Instruments

Texas Instruments' LM3S1751-EQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 56 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control. With a compact flatpack design measuring 14mm x 14mm x 1.6mm, this microcontroller is suitable for space-constrained environments where reliability and performance are crucial.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,188 parts In-Stock

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7,188

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Digiode

USA . 1,857 parts In-Stock

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1,857

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 982 parts In-Stock

1+ parts

$1.000

100+ parts

-

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982

$1.000

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AZTECH Wire

Italy . 758 parts In-Stock

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$15.952

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758

$15.952

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Parana Technologies

USA . 852 parts In-Stock

1+ parts

$29.288

100+ parts

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$57.624

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852

$29.288

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$57.624

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DigiPath Technology Company

USA . 1,343 parts In-Stock

1+ parts

$32.250

100+ parts

$29.670

1k+ parts

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1,343

$32.250

$29.670

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ChromeModa Solutions

Germany . 1,172 parts In-Stock

1+ parts

$32.908

100+ parts

$26.985

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1,172

$32.908

$26.985

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IDEA Electronic Components Group

UK . 1,152 parts In-Stock

1+ parts

$32.908

100+ parts

$31.263

1k+ parts

$29.617

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1,152

$32.908

$31.263

$29.617

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Corphita

USA . 1,274 parts In-Stock

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1,274

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Microchip USA

USA . 496 parts In-Stock

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496

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Overview

Elevate your projects with the LM3S1751-EQC50-A2 microcontroller from Texas Instruments. With its cutting-edge technology and reliable manufacturing, this device offers unbeatable performance and versatility for a wide range of applications. From robotics to automation, this microcontroller delivers exceptional value and benefits to customers seeking high-quality solutions. Trust in Texas Instruments to provide the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications and helps protect the microcontroller from high voltage damage.

Package Shape: SQUARE

Helps in easy handling and placement on the PCB.

Bit Size: 32

Allows for handling of complex data processing and calculations efficiently.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options and compatibility with different power sources.

No. of Terminals: 100

Offers a high level of connectivity for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Provides a compact and efficient form factor for integration into various devices.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even at lower supply voltages.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without performance degradation.

Terminal Finish: TIN

Provides corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Allows for analog to digital conversion, enabling the microcontroller to interface with a wide range of sensors and devices.

Terminal Position: QUAD

Facilitates easy PCB layout and routing of traces for better signal integrity.

ROM Words: 131072

Offers ample storage for program instructions and data, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low profile design for slim devices and space-constrained applications.

Width: 14 mm

Compact size for easy integration into various electronic products.

Maximum Clock Frequency: 0.032 MHz

Fast clock speed for real-time processing and performance.

Length: 14 mm

Compact size for space-saving designs and applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with high reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and fast processing of instructions.

RAM Bytes: 65536

Provides ample memory for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs and ensures reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Standard supply voltage for stable operation and compatibility with other components.

PWM Channels: YES

Provides Pulse Width Modulation channels for precise control of output signals.

ROM Programmability: FLASH

Allows for easy reprogramming and updating of firmware in the microcontroller.

Terminal Pitch: 0.5 mm

Fine pitch for high density mounting and compact layout on PCBs.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes and resistant to moisture-induced damage.

Speed: 50 rpm

High processing speed for efficient operation in various applications.

No. of I/O Lines: 56

Plenty of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1751-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1751-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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