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LM3S1651-IQC80-C5T

Texas Instruments

LM3S1651-IQC80-C5T by Texas Instruments

LM3S1651-IQC80-C5T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 32768 RAM bytes, and 67 I/O lines. It operates at a max clock frequency of 16.384 MHz and is suitable for industrial applications requiring a high-performance Cortex-M3 CPU with ADC and DMA channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,603 parts In-Stock

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Digiode

USA . 3,641 parts In-Stock

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3,641

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Distributors (Availability)

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AZTECH Wire

Italy . 464 parts In-Stock

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$9.736

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464

$9.736

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One Stop Electronics

USA . 377 parts In-Stock

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$33.000

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377

$33.000

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Parana Technologies

USA . 675 parts In-Stock

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$48.521

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675

$48.521

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ChromeModa Solutions

Germany . 2,985 parts In-Stock

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$54.518

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$44.705

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2,985

$54.518

$44.705

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IDEA Electronic Components Group

UK . 2,338 parts In-Stock

1+ parts

$54.518

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$51.792

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$49.066

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2,338

$54.518

$51.792

$49.066

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DigiPath Technology Company

USA . 1,776 parts In-Stock

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$49.153

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Microchip USA

USA . 221 parts In-Stock

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Corphita

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Overview

Experience the power of cutting-edge technology with the LM3S1651-IQC80-C5T microcontroller by Texas Instruments. This state-of-the-art device boasts unmatched quality and reliability, thanks to its industry-leading manufacturer. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value with its advanced features, high performance, and versatile capabilities. Discover the benefits of seamless integration, optimal efficiency, and innovative solutions tailored to meet your needs. Elevate your projects with the LM3S1651-IQC80-C5T and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, giving flexibility in different operating conditions.

Bit Size: 32

32-bit architecture offers higher computational power and efficiency for processing tasks.

CPU Family: CORTEX-M3

Cortex-M3 architecture provides a balance of performance and power efficiency, suitable for various applications.

ROM Words: 131072

Large ROM capacity allows for storing program codes and data, facilitating complex applications and tasks.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and processing, enabling smooth operation of the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, beneficial for applications requiring modulation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance and efficiency by simplifying instructions, making it a suitable choice for embedded systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliability.

Technical Specifications

Microcontrollers LM3S1651-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1651-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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