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LM3S1637-IQC50-A2T

Texas Instruments

LM3S1637-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S1637-IQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 43 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,009 parts In-Stock

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2,009

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Digiode

USA . 1,536 parts In-Stock

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1,536

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Distributors (Availability)

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One Stop Electronics

USA . 481 parts In-Stock

1+ parts

$11.000

100+ parts

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481

$11.000

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AZTECH Wire

Italy . 428 parts In-Stock

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$11.109

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428

$11.109

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Microchip USA

USA . 3,345 parts In-Stock

1+ parts

$41.250

100+ parts

$40.660

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$40.370

10k+ parts

$40.080

3,345

$41.250

$40.660

$40.370

$40.080

Parana Technologies

USA . 803 parts In-Stock

1+ parts

$64.235

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803

$64.235

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DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$70.731

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$65.072

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1,000

$70.731

$65.072

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ChromeModa Solutions

Germany . 5,476 parts In-Stock

1+ parts

$72.174

100+ parts

$59.183

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5,476

$72.174

$59.183

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IDEA Electronic Components Group

UK . 1,215 parts In-Stock

1+ parts

$72.174

100+ parts

$68.565

1k+ parts

$64.957

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1,215

$72.174

$68.565

$64.957

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Component Stockers USA

USA . 676 parts In-Stock

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$99.990

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676

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Corphita

USA . 2,120 parts In-Stock

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2,120

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Overview

Experience the cutting-edge technology of the LM3S1637-IQC50-A2T by Texas Instruments, a top-tier manufacturer known for its superior quality microcontrollers. This innovative product offers unmatched performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value with its advanced features and flexibility. Trust Texas Instruments to provide you with the best-in-class solutions for your next project. Elevate your designs with the LM3S1637-IQC50-A2T and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring reliable performance and long lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 2.75 V

Optimal maximum supply voltage ensures safe operation and prevents damage to the microcontroller.

Package Shape: SQUARE

Square package shape allows for compact PCB design and efficient use of space in electronic devices.

Bit Size: 32

32-bit architecture provides high processing power and performance for complex applications.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages allows flexibility in system design and compatibility with various external components.

No. of Terminals: 100

Abundance of terminals allows for connection to multiple external devices and peripherals, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack package style offers easy integration into PCB layout and efficient heat dissipation for improved thermal performance.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage enables energy-efficient operation and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in extreme environmental conditions and industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable operation in harsh environments and ensures performance in cold conditions.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and reliable electrical connections, enhancing the overall durability of the microcontroller.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion, making the microcontroller suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal position facilitates easy installation on the PCB and ensures secure connections for stable operation.

ROM Words: 131072

Large ROM capacity allows for storing extensive program code, data, and firmware, enabling the microcontroller to handle complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Low seated height facilitates slim and compact device designs, enabling space-saving integration of the microcontroller in various applications.

Width: 14 mm

Compact width dimensions enable efficient PCB layout and space optimization, enhancing the overall design flexibility of electronic devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency allows for fast data processing, real-time operation, and efficient execution of instructions in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Able to withstand peak reflow temperature for a sufficient duration ensures reliable soldering and manufacturing processes without compromising the microcontroller's performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables robust assembly processes and ensures the microcontroller's long-term reliability in various operating conditions.

Length: 14 mm

Compact length dimensions enable flexibility in PCB design and allow for space-efficient integration of the microcontroller in electronic products.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with extreme temperature variations, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high-speed processing, reduced power consumption, and efficient code execution, making the microcontroller suitable for performance-critical applications.

RAM Bytes: 32768

Large RAM capacity allows for efficient data storage, quick access to variables, and dynamic memory management for versatile application support.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and reliable performance, making the microcontroller suitable for energy-efficient and battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder joints, mechanical strength, and space-saving benefits for efficient PCB assembly and rugged electronic designs.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller in various applications.

PWM Channels: YES

PWM channels support precise control of digital signals, motor speed, and power modulation, making the microcontroller ideal for applications requiring accurate pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability allows flexible firmware updates, easy debugging, and quick development cycles for efficient application enhancements and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging, precise PCB layout, and efficient signal routing for compact electronic designs with optimized performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture exposure, requiring standard handling precautions to maintain the integrity and reliability of the microcontroller during assembly and storage.

Speed: 50 rpm

Speed rating of 50 rpm ensures efficient data processing, fast response times, and reliable operation for high-speed applications requiring quick decision-making and real-time control.

No. of I/O Lines: 43

Abundance of I/O lines allows for versatile connectivity to external devices and peripherals, enabling robust communication interfaces and flexible I/O configurations for diverse application requirements.

Technical Specifications

Microcontrollers LM3S1637-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1637-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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