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LM3S1637-IBZ50-A2T

Texas Instruments

LM3S1637-IBZ50-A2T by Texas Instruments

LM3S1637-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 43 I/O lines and PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,995 parts In-Stock

1+ parts

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5,995

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Digiode

USA . 2,672 parts In-Stock

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2,672

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$8.386

100+ parts

-

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576

$8.386

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One Stop Electronics

USA . 1,329 parts In-Stock

1+ parts

$24.000

100+ parts

-

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1,329

$24.000

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Microchip USA

USA . 3,749 parts In-Stock

1+ parts

$41.250

100+ parts

$40.660

1k+ parts

$40.370

10k+ parts

$40.080

3,749

$41.250

$40.660

$40.370

$40.080

Parana Technologies

USA . 1,547 parts In-Stock

1+ parts

$76.864

100+ parts

-

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1,547

$76.864

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DigiPath Technology Company

USA . 1,022 parts In-Stock

1+ parts

$84.637

100+ parts

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1,022

$84.637

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ChromeModa Solutions

Germany . 6,565 parts In-Stock

1+ parts

$86.364

100+ parts

$70.818

1k+ parts

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10k+ parts

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6,565

$86.364

$70.818

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

1+ parts

$86.364

100+ parts

$82.046

1k+ parts

$77.728

10k+ parts

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1,261

$86.364

$82.046

$77.728

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Corphita

USA . 1,820 parts In-Stock

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1,820

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Overview

Unlock endless possibilities with the Texas Instruments LM3S1637-IBZ50-A2T microcontroller! Manufactured with precision and expertise, this product boasts unmatched quality and reliability. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers. Experience seamless performance and efficiency like never before with the LM3S1637-IBZ50-A2T, your gateway to innovation in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliable performance.

Surface Mount: YES

Surface mount design allows for easy integration into various electronic systems.

Maximum Supply Voltage: 2.75 V

High maximum supply voltage allows for flexibility in power input.

Package Shape: SQUARE

Square package shape offers efficient use of space in compact designs.

Bit Size: 32

32-bit architecture provides high processing power and speed.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for compatibility with different systems.

No. of Terminals: 108

Large number of terminals enable connectivity to various external components.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced mechanical strength and reliability.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for usage in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Tin Silver Copper terminal finish enhances conductivity and prevents corrosion.

ADC Channels: YES

Features ADC channels for analog to digital conversion, enabling sensor integration.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low seated height allows for slim and compact device designs.

Width: 10 mm

Compact width for space-efficient PCB layout.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency for quick data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering process within specified time limits.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder joint formation.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC microcontroller type for efficient and streamlined processing.

RAM Bytes: 32768

Large RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and soldering.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Support for PWM channels for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick firmware updates.

Terminal Pitch: 0.8 mm

Compact terminal pitch for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity during storage or soldering.

Speed: 50 rpm

High speed capability for rapid data processing and execution.

No. of I/O Lines: 43

Adequate number of I/O lines for interfacing with external peripherals.

Technical Specifications

Microcontrollers LM3S1637-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1637-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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