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LM3S1635-IBZ50-A2

Texas Instruments

LM3S1635-IBZ50-A2 by Texas Instruments

LM3S1635-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With 56 I/O lines and PWM channels, this microcontroller offers versatile connectivity options for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,757 parts In-Stock

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Digiode

USA . 415 parts In-Stock

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415

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Distributors (Availability)

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AZTECH Wire

Italy . 844 parts In-Stock

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$14.997

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844

$14.997

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One Stop Electronics

USA . 1,186 parts In-Stock

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$27.000

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Microchip USA

USA . 1,797 parts In-Stock

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$45.510

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$44.860

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$44.540

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$44.210

1,797

$45.510

$44.860

$44.540

$44.210

Parana Technologies

USA . 1,341 parts In-Stock

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$54.042

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DigiPath Technology Company

USA . 1,113 parts In-Stock

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$59.507

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$59.507

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IDEA Electronic Components Group

UK . 1,038 parts In-Stock

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$60.721

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$57.685

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$54.649

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1,038

$60.721

$57.685

$54.649

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ChromeModa Solutions

Germany . 765 parts In-Stock

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$60.721

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$49.791

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$60.721

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Corphita

USA . 3,367 parts In-Stock

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Overview

Unlock limitless possibilities with the LM3S1635-IBZ50-A2 microcontroller by Texas Instruments. Crafted with precision and excellence, this powerhouse of a device boasts unparalleled quality and reliability that only a trusted manufacturer like Texas Instruments can deliver. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers seeking cutting-edge technology. Experience seamless performance and efficiency with the LM3S1635-IBZ50-A2, setting new standards in innovation and functionality for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and can withstand various environmental conditions, making this microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protects the microcontroller from overvoltage conditions.

Bit Size: 32

A 32-bit architecture provides high computational capability and performance, suitable for handling complex tasks and applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5 V and 3.3 V) allows flexibility in designing and integrating the microcontroller into different systems.

No. of Terminals: 108

Having a large number of terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and reliability in connection, making it suitable for compact and robust designs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40°C) ensures the microcontroller can function in extreme cold conditions, making it suitable for harsh environments.

ADC Channels: YES

The inclusion of Analog-to-Digital Converter (ADC) channels allows for analog signal processing and sensor interfacing, expanding the range of applications for the microcontroller.

ROM Words: 131072

The large ROM capacity of 131072 words enables storing of program instructions and data, essential for running complex software algorithms and applications.

Technical Specifications

Microcontrollers LM3S1635-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1635-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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