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LM3S1635-EQC50-A2T

Texas Instruments

LM3S1635-EQC50-A2T by Texas Instruments

LM3S1635-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates in industrial temperatures (-40 to 105 °C) and has PWM channels, ADC channels, and 56 I/O lines for various applications like embedded systems and IoT devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,555 parts In-Stock

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Digiode

USA . 2,588 parts In-Stock

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2,588

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Distributors (Availability)

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AZTECH Wire

Italy . 765 parts In-Stock

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$12.935

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765

$12.935

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One Stop Electronics

USA . 671 parts In-Stock

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$26.000

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671

$26.000

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Parana Technologies

USA . 2,073 parts In-Stock

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$51.721

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$51.721

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DigiPath Technology Company

USA . 794 parts In-Stock

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$56.952

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794

$56.952

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ChromeModa Solutions

Germany . 2,644 parts In-Stock

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$58.114

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$47.653

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2,644

$58.114

$47.653

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IDEA Electronic Components Group

UK . 1,074 parts In-Stock

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$58.114

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$55.208

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$52.303

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1,074

$58.114

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$52.303

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Corphita

USA . 3,192 parts In-Stock

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Microchip USA

USA . 309 parts In-Stock

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Overview

Discover the LM3S1635-EQC50-A2T by Texas Instruments, a top-of-the-line microcontroller designed for a wide range of applications. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge technology in a compact, square-shaped package. Offering a maximum clock frequency of 0.032 MHz and 56 I/O lines, this microcontroller is perfect for industrial-grade projects requiring precision and performance. Unlock endless possibilities with the LM3S1635-EQC50-A2T and experience unparalleled value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage helps in reducing power consumption and heat generation.

Package Shape: SQUARE

Square package shape provides better thermal dissipation and efficient use of PCB space.

Bit Size: 32

32-bit architecture offers high processing power and performance for various applications.

Power Supplies (V): 2.5, 3.3

Multiple power supply options provide flexibility in power management and compatibility with different systems.

No. of Terminals: 100

100 terminals offer a wide range of I/O options, making the microcontroller versatile for different connectivity needs.

Package Style (Meter): FLATPACK

Flatpack package style allows for easy mounting and soldering on the PCB.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures reliable operation even in low-power conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes the microcontroller suitable for industrial applications with demanding temperature requirements.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operational stability in harsh environmental conditions.

Terminal Finish: TIN

Tin terminal finish offers good electrical conductivity and corrosion resistance.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion, expanding the microcontroller's capabilities.

Terminal Position: QUAD

Quad terminal position provides a balanced layout for efficient signal routing and connectivity.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

Low seated height saves PCB space and enables compact designs.

Width: 14 mm

Narrow width makes the microcontroller suitable for compact and space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency enables fast processing and execution of instructions.

Length: 14 mm

Short length facilitates the integration of the microcontroller into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in extreme temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and streamlined processing, suitable for embedded systems.

RAM Bytes: 32768

Large RAM capacity enables efficient data processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form makes soldering and mounting on PCBs easier and more secure.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals, essential for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the microcontroller's memory.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density connections, suitable for complex circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, ensuring proper handling and storage requirements.

Speed: 50 rpm

High processing speed of 50 rpm enables efficient data processing and real-time control applications.

No. of I/O Lines: 56

56 I/O lines offer versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1635-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1635-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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