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LM3S1627-IQR50-A0

Texas Instruments

LM3S1627-IQR50-A0 by Texas Instruments

Texas Instruments LM3S1627-IQR50-A0 microcontroller features 32-bit CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications with peripherals like DMA, PWM(6), QEI(2), TIMER(4), WDT. Operates at -40 to 85°C temperature range with low power mode and integrated cache.

Median Price

$13.200

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 157 parts In-Stock

1+ parts

$3.779

100+ parts

-

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157

$3.779

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Chip1Stop

Japan . 157 parts In-Stock

1+ parts

$13.200

100+ parts

-

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-

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157

$13.200

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Verical

USA . 157 parts In-Stock

1+ parts

$15.016

100+ parts

-

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157

$15.016

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 382 parts In-Stock

1+ parts

$11.003

100+ parts

-

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382

$11.003

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Vyrian

USA . 2,477 parts In-Stock

1+ parts

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2,477

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Distributors (Availability)

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Corphita

USA . 1,544 parts In-Stock

1+ parts

$10.424

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-

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1,544

$10.424

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AZTECH Wire

Italy . 547 parts In-Stock

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$18.570

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547

$18.570

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Microchip USA

USA . 1,490 parts In-Stock

1+ parts

$49.040

100+ parts

$48.340

1k+ parts

$47.990

10k+ parts

$47.640

1,490

$49.040

$48.340

$47.990

$47.640

Parana Technologies

USA . 1,607 parts In-Stock

1+ parts

$57.972

100+ parts

-

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1,607

$57.972

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DigiPath Technology Company

USA . 1,527 parts In-Stock

1+ parts

$63.834

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1,527

$63.834

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ChromeModa Solutions

Germany . 2,462 parts In-Stock

1+ parts

$65.137

100+ parts

$53.412

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2,462

$65.137

$53.412

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IDEA Electronic Components Group

UK . 2,120 parts In-Stock

1+ parts

$65.137

100+ parts

$61.880

1k+ parts

$58.623

10k+ parts

-

2,120

$65.137

$61.880

$58.623

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Lixinc

USA . 3,035 parts In-Stock

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3,035

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Overview

Enhance your electronic projects with the LM3S1627-IQR50-A0 by Texas Instruments, a top-tier microcontroller that boasts unparalleled quality and reliability. As a leader in the industry, Texas Instruments delivers cutting-edge technology that ensures optimal performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers exceptional value, benefits, and advantages to customers seeking seamless connectivity, low power consumption, and high-speed processing capabilities. Elevate your designs with the LM3S1627-IQR50-A0 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for compact and portable devices.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency by reducing the access time to frequently used data.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage of 2.75 V allows for efficient power consumption and extended battery life in battery-powered applications.

On Chip Data RAM Width: 8

With a data RAM width of 8, the microcontroller can handle and process data efficiently, contributing to overall system performance.

Bit Size: 32

The 32-bit architecture of the microcontroller allows for handling larger data and executing more complex operations, suitable for advanced applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in designing and integrating the microcontroller into various electronic systems.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

No. of Timers: 4

Having 4 timers allows for precise timing control in applications such as signal processing, motor control, and communication protocols.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller simplifies the instruction set, leading to faster execution of instructions and efficient use of resources.

No. of I/O Lines: 33

With 33 I/O lines, the microcontroller offers extensive connectivity options for interfacing with external devices and peripherals, enhancing its versatility.

Technical Specifications

Microcontrollers LM3S1627-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

DMA, PWM(6), QEI(2), TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S1627-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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