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LM3S1625-IQR50-A0T

Texas Instruments

LM3S1625-IQR50-A0T by Texas Instruments

LM3S1625-IQR50-A0T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range from -40 to 85 °C, it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,134 parts In-Stock

1+ parts

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4,134

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Digiode

USA . 1,900 parts In-Stock

1+ parts

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1,900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,005 parts In-Stock

1+ parts

$1.000

100+ parts

-

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1,005

$1.000

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AZTECH Wire

Italy . 831 parts In-Stock

1+ parts

$10.654

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-

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831

$10.654

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Microchip USA

USA . 3,380 parts In-Stock

1+ parts

$24.820

100+ parts

$24.470

1k+ parts

$24.290

10k+ parts

$24.110

3,380

$24.820

$24.470

$24.290

$24.110

Advanced Electronics

New Zealand . 63 parts In-Stock

1+ parts

$30.763

100+ parts

$27.994

1k+ parts

$25.226

10k+ parts

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63

$30.763

$27.994

$25.226

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Parana Technologies

USA . 1,857 parts In-Stock

1+ parts

$63.232

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1,857

$63.232

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DigiPath Technology Company

USA . 907 parts In-Stock

1+ parts

$69.626

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907

$69.626

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IDEA Electronic Components Group

UK . 772 parts In-Stock

1+ parts

$71.047

100+ parts

$67.495

1k+ parts

$63.942

10k+ parts

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772

$71.047

$67.495

$63.942

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ChromeModa Solutions

Germany . 156 parts In-Stock

1+ parts

$71.047

100+ parts

$58.259

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156

$71.047

$58.259

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Component Stockers USA

USA . 756 parts In-Stock

1+ parts

$99.990

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756

$99.990

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Corphita

USA . 4,954 parts In-Stock

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4,954

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Overview

Unlock limitless possibilities with the LM3S1625-IQR50-A0T microcontroller from Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a cutting-edge solution for your electronic projects. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and efficiency. Experience seamless operation, enhanced functionality, and innovative features that will take your projects to the next level. Elevate your designs with the LM3S1625-IQR50-A0T and redefine what's possible in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V provides efficiency and power management for the microcontroller.

Package Shape: SQUARE

Square package shape helps in easy placement and alignment during assembly.

Bit Size: 32

32-bit architecture enhances processing power and efficiency of the microcontroller.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) allows for flexibility in application design.

No. of Terminals: 64

64 terminals provide ample connectivity options for interfacing with other components and peripherals.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures stable operation even during low power conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand higher temperature environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance in cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides a good contact surface and solderability for reliable connections.

ADC Channels: YES

Support for ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and devices.

Terminal Position: QUAD

Quad terminal position enables efficient soldering and robust connection stability.

ROM Words: 131072

Large ROM capacity of 131072 words provides ample memory for program storage and execution.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm saves space and facilitates compact PCB design.

Width: 10 mm

Width of 10mm allows for streamlined placement on the PCB, optimizing layout and design.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32kHz enables fast processing and operation.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature allows for efficient and reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and component reliability.

Length: 10 mm

Length of 10mm provides a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller supports efficient and fast processing for various applications.

RAM Bytes: 32768

With 32768 bytes of RAM, the microcontroller can handle data processing and storage efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for optimized performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and enhances mechanical strength.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V provides stable and efficient power delivery for the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control of signals, making the microcontroller suitable for motor control and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the microcontroller firmware.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microcontroller supports fine-pitch connections for compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Speed: 50 rpm

Operational speed of 50rpm allows for efficient processing and execution of tasks.

No. of I/O Lines: 33

33 I/O lines provide versatility for interfacing with external devices and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers LM3S1625-IQR50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1625-IQR50-A0T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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