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LM3S1620-IBZ25-A2T

Texas Instruments

LM3S1620-IBZ25-A2T by Texas Instruments

LM3S1620-IBZ25-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 52 I/O lines and PWM channels. With a temperature range of -40 to 85 °C, it offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,709 parts In-Stock

1+ parts

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6,709

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Digiode

USA . 3,975 parts In-Stock

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3,975

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,434 parts In-Stock

1+ parts

$13.000

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1,434

$13.000

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Parana Technologies

USA . 1,599 parts In-Stock

1+ parts

$17.689

100+ parts

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1k+ parts

$17.875

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1,599

$17.689

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$17.875

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AZTECH Wire

Italy . 229 parts In-Stock

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$18.339

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229

$18.339

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DigiPath Technology Company

USA . 2,308 parts In-Stock

1+ parts

$19.478

100+ parts

$17.919

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2,308

$19.478

$17.919

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IDEA Electronic Components Group

UK . 1,946 parts In-Stock

1+ parts

$19.875

100+ parts

$18.881

1k+ parts

$17.888

10k+ parts

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1,946

$19.875

$18.881

$17.888

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ChromeModa Solutions

Germany . 1,339 parts In-Stock

1+ parts

$19.875

100+ parts

$16.298

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1,339

$19.875

$16.298

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Microchip USA

USA . 2,469 parts In-Stock

1+ parts

$37.790

100+ parts

$37.250

1k+ parts

$36.980

10k+ parts

$36.710

2,469

$37.790

$37.250

$36.980

$36.710

Corphita

USA . 4,728 parts In-Stock

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4,728

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Overview

Experience the next level of performance and reliability with the LM3S1620-IBZ25-A2T microcontroller by Texas Instruments. As a leader in innovation, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers seeking top-notch quality and seamless integration. Unlock endless possibilities and elevate your projects with the LM3S1620-IBZ25-A2T microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing assembly costs.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a specified voltage range, ensuring reliable performance without risk of damage.

Package Shape: SQUARE

Square package shape allows for easier placement on the PCB and efficient use of space.

Bit Size: 32

32-bit architecture enables faster processing speed and enhanced performance for the microcontroller.

Power Supplies (V): 2.5,3.3

Ability to work with multiple power supplies provides flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 108

Ample number of terminals allow for versatile connectivity options and interfacing with external components.

Package Style (Meter): GRID ARRAY

Grid array package style offers reliable contact points for soldering and connection, ensuring stable operation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the microcontroller suitable for use in harsh environments or extreme conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for faster data processing and improved overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution and enhances overall speed and performance of the microcontroller.

RAM Bytes: 32768

Large RAM size allows for storage of data and program execution, enhancing the versatility and capability of the microcontroller.

ROM Programmability: FLASH

Flash ROM enables easy reprogramming of the microcontroller, facilitating firmware updates and customization of functionality.

Technical Specifications

Microcontrollers LM3S1620-IBZ25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1620-IBZ25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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