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LM3S1608-IQC50-A2T

Texas Instruments

LM3S1608-IQC50-A2T by Texas Instruments

Texas Instruments LM3S1608-IQC50-A2T microcontroller features 32-bit CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications with ADC channels, 8-Ch 10-Bit ADCs, and low power mode support. Offers connectivity via I2C(2), SSI(2), UART(2) interfaces for versatile usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,486 parts In-Stock

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4,486

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Vyrian

USA . 3,840 parts In-Stock

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3,840

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Distributors (Availability)

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AZTECH Wire

Italy . 311 parts In-Stock

1+ parts

$15.578

100+ parts

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311

$15.578

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One Stop Electronics

USA . 1,414 parts In-Stock

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$26.000

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1,414

$26.000

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Parana Technologies

USA . 252 parts In-Stock

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$58.139

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252

$58.139

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DigiPath Technology Company

USA . 2,020 parts In-Stock

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$64.018

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2,020

$64.018

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Microchip USA

USA . 174 parts In-Stock

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$64.050

100+ parts

$63.490

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$63.490

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$62.940

174

$64.050

$63.490

$63.490

$62.940

ChromeModa Solutions

Germany . 4,945 parts In-Stock

1+ parts

$65.325

100+ parts

$53.566

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4,945

$65.325

$53.566

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IDEA Electronic Components Group

UK . 1,980 parts In-Stock

1+ parts

$65.325

100+ parts

$62.059

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$58.792

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1,980

$65.325

$62.059

$58.792

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Component Stockers USA

USA . 315 parts In-Stock

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$99.990

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315

$99.990

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 1,620 parts In-Stock

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Corphita

USA . 1,385 parts In-Stock

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1,385

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Overview

Unlock the power of cutting-edge technology with the LM3S1608-IQC50-A2T microcontroller by Texas Instruments. Built with precision and expertise, this device offers unparalleled performance for a wide range of applications. Whether you're looking to streamline industrial processes or create innovative solutions in the automotive sector, this microcontroller delivers exceptional value, reliability, and efficiency. Stay ahead of the curve and elevate your projects with the LM3S1608-IQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller, making it durable and reliable for various applications.

Integrated Cache: YES

Having integrated cache improves the speed and performance of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 2.75 V

This voltage range allows for efficient power utilization and operation within safe limits.

ADC Channels: YES

The presence of Analog to Digital Converters enables the microcontroller to interface with analog sensors and signals, expanding its functionality.

ROM Programmability: FLASH

ROM being programmable via FLASH allows for flexible firmware updates and customization without needing a separate programming tool or equipment.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it provides efficient and fast processing, making it suitable for real-time applications and performance-critical tasks.

Connectivity: I2C(2), SSI(2), UART(2)

Having multiple connectivity options such as I2C, SSI, and UART makes it versatile for interfacing with various devices and communication protocols.

Speed: 50 rpm

This moderate speed ensures smooth operation and efficient processing for the intended applications of the microcontroller.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of moisture sensitivity, suitable for storage and usage in typical indoor environments without risk of damage.

No. of I/O Lines: 52

With a high number of I/O lines, the microcontroller can easily interface with a wide range of external devices and peripherals, enhancing its versatility.

Technical Specifications

Microcontrollers LM3S1608-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SSI(2), UART(2)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1608-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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