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LM3S1608-IQC50-A2

Texas Instruments

LM3S1608-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1608-IQC50-A2 is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 32768 RAM bytes. It features 8-channel ADC, 4 timers, and Ethernet connectivity. Ideal for industrial applications requiring low power consumption and high-speed processing up to 8.192 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,135 parts In-Stock

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Vyrian

USA . 3,837 parts In-Stock

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AZTECH Wire

Italy . 199 parts In-Stock

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$5.478

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199

$5.478

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One Stop Electronics

USA . 1,119 parts In-Stock

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$9.000

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$9.000

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Parana Technologies

USA . 2,108 parts In-Stock

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$57.774

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$5,365.225

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$51.997

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$57.774

$5,365.225

$51.997

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DigiPath Technology Company

USA . 1,402 parts In-Stock

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$63.617

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$63.617

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$63.813

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$58.070

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$52.327

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$63.813

$58.070

$52.327

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IDEA Electronic Components Group

UK . 1,422 parts In-Stock

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$64.915

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$61.669

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$58.424

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$64.915

$61.669

$58.424

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ChromeModa Solutions

Germany . 649 parts In-Stock

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$64.915

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$53.230

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649

$64.915

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 14,334 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,575 parts In-Stock

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Microchip USA

USA . 5,233 parts In-Stock

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Corphita

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Kepictronics

USA . 1,000 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 320 parts In-Stock

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Metaverse IC Inc.

Canada . 313 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S1608-IQC50-A2 microcontroller by Texas Instruments. Designed with cutting-edge technology and superior quality, this microcontroller is perfect for a wide range of applications. With integrated cache, low power mode, and connectivity options like Ethernet and UART, this microcontroller offers unmatched value and performance. Whether you're working on industrial automation, IoT devices, or robotics, the LM3S1608-IQC50-A2 delivers reliable results with its advanced features and high-speed operation. Choose Texas Instruments for top-notch quality and stay ahead of the competition in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and long-lasting.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microcontroller.

Package Shape: SQUARE

Provides a compact design for efficient PCB layout and space-saving in electronic devices.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, ensuring the stability and longevity of the device.

Maximum Clock Frequency: 8.192 MHz

Supports high-speed operation for swift data processing and quick response times in applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for improved performance and power efficiency.

ROM Programmability: FLASH

Allows for easy updating and reprogramming of the microcontroller's memory, enhancing flexibility and customization.

Analog To Digital Convertors: 8-Ch 10-Bit

Enables precise conversion of analog signals to digital data for accurate sensor readings and control in applications.

Connectivity: ETHERNET, I2C(2), SSI(2), UART(2)

Supports a variety of communication interfaces for seamless connectivity with other devices and networks.

No. of Serial I/Os: 6

Provides multiple serial I/O ports for interfacing with external peripherals and expanding the capabilities of the microcontroller.

Technical Specifications

Microcontrollers LM3S1608-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), SSI(2), UART(2)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1608-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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