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LM3S1608-EQC50-A2T

Texas Instruments

LM3S1608-EQC50-A2T by Texas Instruments

LM3S1608-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 8.192 MHz, making it ideal for industrial applications requiring high-speed processing and control capabilities. With a package style of FLATPACK and GULL WING terminal form, this microcontroller offers versatile mounting options for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,922 parts In-Stock

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Digiode

USA . 432 parts In-Stock

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432

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Distributors (Availability)

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One Stop Electronics

USA . 1,336 parts In-Stock

1+ parts

$9.000

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1,336

$9.000

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AZTECH Wire

Italy . 554 parts In-Stock

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$15.128

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554

$15.128

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Parana Technologies

USA . 1,063 parts In-Stock

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$52.722

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1,063

$52.722

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DigiPath Technology Company

USA . 463 parts In-Stock

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$58.053

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463

$58.053

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ChromeModa Solutions

Germany . 6,866 parts In-Stock

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$59.238

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$48.575

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6,866

$59.238

$48.575

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IDEA Electronic Components Group

UK . 421 parts In-Stock

1+ parts

$59.238

100+ parts

$56.276

1k+ parts

$53.314

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421

$59.238

$56.276

$53.314

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Corphita

USA . 1,552 parts In-Stock

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Microchip USA

USA . 475 parts In-Stock

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475

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Overview

Unlock the potential of your next project with the LM3S1608-EQC50-A2T microcontroller from Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers top-of-the-line products that are trusted by professionals worldwide. This microcontroller is perfect for a wide range of applications, offering reliability, efficiency, and performance that exceed expectations. Experience seamless integration and innovative design with this versatile microcontroller, providing value and benefits that will take your projects to the next level. Choose Texas Instruments for unmatched quality and performance in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

Ideal for low power applications, ensuring efficient energy consumption.

Package Shape: SQUARE

Facilitates uniform and compact integration into electronic devices.

Bit Size: 32

Provides a high level of processing power and capability for complex computations.

Power Supplies (V): 2.5,3.3

Offers flexibility in power input options, catering to different voltage requirements.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Offers a flat and compact design, optimizing space utilization in electronic devices.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even under low voltage conditions, enhancing reliability.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it versatile for various operating environments.

Terminal Finish: TIN

Provides corrosion resistance and reliable electrical contacts for long-term use.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Facilitates easy and secure mounting on the circuit board, ensuring stable connectivity.

ROM Words: 131072

Offers a large memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications, fitting within slim electronic devices.

Width: 14 mm

Compact form factor for integration into small electronic devices or PCB designs.

Maximum Clock Frequency: 8.192 MHz

Provides fast processing speed for efficient execution of tasks and operations.

Length: 14 mm

Compact dimensions for easy integration and space-saving in electronic designs.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous operating conditions of industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient processing and power consumption.

RAM Bytes: 32768

Offers ample random access memory for data storage and manipulation during operation.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high reliability.

Terminal Form: GULL WING

Facilitates easy soldering and secure attachment to the circuit board for stable connections.

Nominal Supply Voltage: 2.5 V

Stable voltage input for consistent and reliable performance of the microcontroller.

PWM Channels: YES

Supports Pulse-Width Modulation (PWM) output for precise control of devices like motors or LED brightness.

ROM Programmability: FLASH

Enables reprogramming of the memory content, allowing for flexibility and updates in the application firmware.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density PCB layouts and compact electronic designs.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability in humid or damp conditions.

Speed: 50 rpm

Offers processing speed suitable for various applications, balancing performance and energy efficiency.

No. of I/O Lines: 52

Provides a sufficient number of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1608-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1608-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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