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LM3S1601-IQC50-A2T

Texas Instruments

LM3S1601-IQC50-A2T by Texas Instruments

Texas Instruments LM3S1601-IQC50-A2T is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 32768 RAM bytes. It operates at up to 0.032 MHz clock frequency, ideal for industrial applications requiring low power consumption and connectivity via I2C(2), SSI(2), UART(3).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,394 parts In-Stock

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Digiode

USA . 1,372 parts In-Stock

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1,372

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Distributors (Availability)

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AZTECH Wire

Italy . 889 parts In-Stock

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$13.098

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889

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One Stop Electronics

USA . 1,475 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 292 parts In-Stock

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$23.043

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$23.686

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DigiPath Technology Company

USA . 2,155 parts In-Stock

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$25.373

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$23.343

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$25.373

$23.343

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ChromeModa Solutions

Germany . 5,359 parts In-Stock

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$25.891

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$21.231

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$25.891

$21.231

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IDEA Electronic Components Group

UK . 538 parts In-Stock

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$25.891

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$24.596

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$23.302

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538

$25.891

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$23.302

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Component Stockers USA

USA . 779 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 3,708 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

USA . 2,806 parts In-Stock

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Kepictronics

USA . 2,472 parts In-Stock

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Lixinc

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Microchip USA

USA . 295 parts In-Stock

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Overview

Discover the Texas Instruments LM3S1601-IQC50-A2T microcontroller, a top-of-the-line product designed to elevate your projects to new heights. With cutting-edge technology and unbeatable quality from Texas Instruments, this microcontroller offers unparalleled value and benefits for a wide range of applications. Whether you are looking to enhance automation systems, develop IoT devices, or create innovative embedded solutions, the LM3S1601-IQC50-A2T provides the power, performance, and reliability you need. Elevate your designs with this versatile and reliable microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring it can withstand tough environmental conditions.

Integrated Cache: YES

Having an integrated cache helps improve the speed and efficiency of the microcontroller by storing frequently accessed data.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and prevents damage to the microcontroller.

On Chip Data RAM Width: 8

With a data RAM width of 8, the microcontroller can efficiently process and store data during operation.

Package Shape: SQUARE

The square package shape allows for easy and secure placement of the microcontroller on circuit boards, simplifying assembly.

Bit Size: 32

A 32-bit architecture provides higher processing power and performance compared to lower bit sizes, making this microcontroller suitable for complex tasks.

Power Supplies (V): 2.5,3.3

Supporting multiple power supply voltages gives flexibility in designing circuits and ensures compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals enables connectivity to a wide range of external components and peripherals, enhancing the microcontroller's functionality.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures reliable operation even under lower power conditions, increasing the versatility of this microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can be used in challenging environments without compromising performance.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family indicates that this microcontroller offers a balance of high performance, low power consumption, and advanced features for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the microcontroller remains operational in cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

Analog-to-digital converter (ADC) channels allow the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition.

ROM Words: 131072

The large ROM capacity of 131072 words provides ample space for program storage, allowing for complex algorithms and applications to be implemented.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm saves space on the circuit board and allows for compact designs in electronic devices.

Width: 14 mm

With a compact width of 14mm, this microcontroller can be easily integrated into various electronic devices without taking up much space.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the microcontroller during manufacturing and maintenance, reducing time and effort required for quality assurance.

No. of Timers: 4

Having four timers adds versatility to the microcontroller by enabling precise timing functions and synchronization of tasks in applications.

RAM Bytes: 32768

The generous RAM capacity of 32768 bytes allows for efficient data storage and manipulation during program execution, enhancing the microcontroller's performance.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology provides low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

No. of Serial I/Os: 7

Seven serial I/O interfaces offer a wide range of communication options with external devices, increasing the connectivity and compatibility of this microcontroller.

Technical Specifications

Microcontrollers LM3S1601-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S1601-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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