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LM3S1538-IBZ50-A2T

Texas Instruments

LM3S1538-IBZ50-A2T by Texas Instruments

LM3S1538-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at temperatures from -40 to 85°C. It features 65536 bytes of RAM, FLASH ROM programmability, and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,859 parts In-Stock

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3,859

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Digiode

USA . 2,525 parts In-Stock

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2,525

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Distributors (Availability)

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AZTECH Wire

Italy . 325 parts In-Stock

1+ parts

$17.670

100+ parts

-

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325

$17.670

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One Stop Electronics

USA . 294 parts In-Stock

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$29.000

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-

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294

$29.000

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Parana Technologies

USA . 2,239 parts In-Stock

1+ parts

$29.544

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$60.586

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2,239

$29.544

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$60.586

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DigiPath Technology Company

USA . 1,124 parts In-Stock

1+ parts

$32.532

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1,124

$32.532

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ChromeModa Solutions

Germany . 4,382 parts In-Stock

1+ parts

$33.196

100+ parts

$27.221

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4,382

$33.196

$27.221

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IDEA Electronic Components Group

UK . 1,023 parts In-Stock

1+ parts

$33.196

100+ parts

$31.536

1k+ parts

$29.876

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1,023

$33.196

$31.536

$29.876

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Microchip USA

USA . 2,861 parts In-Stock

1+ parts

$44.010

100+ parts

$43.380

1k+ parts

$43.070

10k+ parts

$42.750

2,861

$44.010

$43.380

$43.070

$42.750

Corphita

USA . 4,081 parts In-Stock

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4,081

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Overview

Unleash the power of innovation with the LM3S1538-IBZ50-A2T microcontroller from Texas Instruments. Crafted with precision and expertise, this cutting-edge device offers unmatched performance in a wide range of applications. Whether you're designing smart home systems, automotive electronics, or industrial automation, this microcontroller delivers reliability and efficiency like no other. Experience seamless integration, high-speed processing, and versatile functionality that will elevate your projects to new heights. Trust Texas Instruments for top-quality solutions that exceed expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 2.75 V

Allows for stable operation within the specified voltage range.

Package Shape: SQUARE

Uniform shape for easy mounting and compatibility with standard PCB designs.

Bit Size: 32

Suitable for handling complex computations and tasks efficiently.

Power Supplies (V): 2.5,3.3

Offers compatibility with commonly used voltage supplies.

No. of Terminals: 108

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): GRID ARRAY

Allows for easy and secure mounting on the PCB.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and resistance to corrosion.

ADC Channels: YES

Allows for analog-to-digital conversion for sensor interfacing.

Terminal Position: BOTTOM

Facilitates PCB layout and assembly.

ROM Words: 98304

Ample memory capacity for storing program data.

Maximum Seated Height: 1.5 mm

Compact size for space-constrained applications.

Width: 10 mm

Compact form factor for easy integration.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

Suitable for reflow soldering processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly.

Length: 10 mm

Consistent dimensions for uniformity in PCB design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and reduced power consumption.

RAM Bytes: 65536

Sufficient random access memory for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for secure electrical connections.

Nominal Supply Voltage: 2.5 V

Standard voltage supply for reliable operation.

PWM Channels: YES

Supports pulse-width modulation for precise control of peripheral devices.

ROM Programmability: FLASH

Flash programmable memory for easy firmware updates.

Terminal Pitch: 0.8 mm

Fine pitch for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage during storage and operation.

Speed: 50 rpm

Capable of processing data at a high speed for real-time applications.

No. of I/O Lines: 43

Sufficient input/output lines for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S1538-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1538-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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