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LM3S1512-IBZ25-A2

Texas Instruments

LM3S1512-IBZ25-A2 by Texas Instruments

LM3S1512-IBZ25-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 65536 bytes of RAM and 98304 ROM words, suitable for industrial applications requiring PWM channels and ADC functionality. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,838 parts In-Stock

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Digiode

USA . 1,321 parts In-Stock

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1,321

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 644 parts In-Stock

1+ parts

$12.000

100+ parts

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644

$12.000

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Ampacity Inc.

Singapore . 560 parts In-Stock

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$15.000

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560

$15.000

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AZTECH Wire

Italy . 804 parts In-Stock

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$16.274

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804

$16.274

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Microchip USA

USA . 2,795 parts In-Stock

1+ parts

$45.950

100+ parts

$45.290

1k+ parts

$44.960

10k+ parts

$44.630

2,795

$45.950

$45.290

$44.960

$44.630

Parana Technologies

USA . 697 parts In-Stock

1+ parts

$55.663

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697

$55.663

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IDEA Electronic Components Group

UK . 2,043 parts In-Stock

1+ parts

$62.543

100+ parts

$59.416

1k+ parts

$56.289

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2,043

$62.543

$59.416

$56.289

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ChromeModa Solutions

Germany . 1,750 parts In-Stock

1+ parts

$62.543

100+ parts

$51.285

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1,750

$62.543

$51.285

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Corphita

USA . 3,290 parts In-Stock

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3,290

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DigiPath Technology Company

USA . 801 parts In-Stock

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$56.389

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801

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$56.389

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Overview

Unlock the full potential of your next project with the LM3S1512-IBZ25-A2 microcontroller by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and performance. Whether you're designing IoT devices or industrial automation systems, this microcontroller's advanced features and capabilities will take your project to the next level. Trust Texas Instruments to provide the innovative solutions you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller.

Surface Mount: YES

Makes it easy to install and saves space on the PCB.

Maximum Supply Voltage: 2.75 V

Allows for a wide range of power supply options.

Package Shape: SQUARE

Simplifies PCB layout and design.

Bit Size: 32

Provides sufficient processing power for various applications.

Power Supplies (V): 2.5,3.3

Offers flexibility in power input.

No. of Terminals: 108

Plenty of connection points for interfacing with other components.

Package Style (Meter): GRID ARRAY

Ensures a secure and stable connection on the PCB.

Minimum Supply Voltage: 2.25 V

Allows for low power operation.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where temperature can vary.

Minimum Operating Temperature: -40 °C

Can operate in harsh environments with low temperatures.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for terminals.

ADC Channels: YES

Enables analog to digital conversion for sensing and communication.

Terminal Position: BOTTOM

Facilitates easy soldering during assembly.

ROM Words: 98304

Offers a large non-volatile memory for storing program data.

Maximum Seated Height: 1.5 mm

Allows for compact designs in electronic devices.

Width: 10 mm

Small footprint for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

Provides high processing speed for efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during assembly process.

Length: 10 mm

Compact size for integration into various devices.

Temperature Grade: INDUSTRIAL

Meets industry standards for reliable operation in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and fast processing.

RAM Bytes: 65536

Provides ample volatile memory for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption for energy efficiency.

Terminal Form: BALL

Enables reliable connection with other components.

Nominal Supply Voltage: 2.5 V

Stable voltage input for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation for controlling analog devices.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM for firmware updates.

Terminal Pitch: 0.8 mm

Fine pitch for precise soldering and connection.

Moisture Sensitivity Level (MSL): 3

Ideal for applications in varied humidity conditions.

Speed: 25 rpm

Capable of high speed processing for real-time applications.

No. of I/O Lines: 58

Sufficient I/O capability for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S1512-IBZ25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

58

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1512-IBZ25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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