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LM3S1332-EQC50-A2T

Texas Instruments

LM3S1332-EQC50-A2T by Texas Instruments

Texas Instruments LM3S1332-EQC50-A2T is a 32-bit microcontroller with 98304 ROM words and 16384 RAM bytes. Operating at up to 0.032 MHz, it offers 57 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,282 parts In-Stock

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Digiode

USA . 424 parts In-Stock

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424

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Distributors (Availability)

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AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$19.478

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418

$19.478

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One Stop Electronics

USA . 1,221 parts In-Stock

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$21.000

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$21.000

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Parana Technologies

USA . 1,437 parts In-Stock

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$59.956

100+ parts

$5,567.800

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$53.960

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1,437

$59.956

$5,567.800

$53.960

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DigiPath Technology Company

USA . 1,161 parts In-Stock

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$66.019

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1,161

$66.019

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ChromeModa Solutions

Germany . 2,106 parts In-Stock

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$67.366

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$55.240

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2,106

$67.366

$55.240

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IDEA Electronic Components Group

UK . 1,097 parts In-Stock

1+ parts

$67.366

100+ parts

$63.998

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$60.629

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1,097

$67.366

$63.998

$60.629

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Corphita

USA . 789 parts In-Stock

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789

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Microchip USA

USA . 485 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1332-EQC50-A2T microcontroller by Texas Instruments. Designed with precision and reliability in mind, this innovative product offers a wide range of applications in various industries. From automotive to consumer electronics, this microcontroller provides unmatched performance and efficiency. With advanced features and cutting-edge technology, customers can expect seamless integration and superior functionality. Trust in Texas Instruments for quality products that deliver exceptional value and benefits to meet all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance in various conditions.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications and helps in reducing energy consumption.

Package Shape: SQUARE

Optimal shape for compact designs and efficient use of PCB space.

Bit Size: 32

Provides ample processing power for handling complex tasks and calculations.

Power Supplies (V): 2.5,3.3

Offers flexibility in power options, allowing compatibility with a variety of systems.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK

Flatpack design facilitates easier mounting and soldering onto PCBs.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even in low voltage scenarios.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for a wide range of operating conditions.

ADC Channels: YES

Ability to convert analog signals to digital, enabling the microcontroller to interface with various sensors and devices.

Terminal Position: QUAD

Quad terminal layout for easy and organized wiring connections.

ROM Words: 98304

Ample ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim applications.

Width: 14 mm

Compact width for space-saving PCB layouts.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast and efficient processing of instructions.

Length: 14 mm

Compact length for space-efficient PCB designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient and streamlined processing of instructions.

RAM Bytes: 16384

Sufficient RAM for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable solder connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent and reliable performance.

PWM Channels: YES

PWM channels for precise control of analog outputs such as motor speeds and LED brightness.

ROM Programmability: FLASH

Flash ROM for flexible and reprogrammable storage of program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on PCBs.

Speed: 50 rpm

Operates at a speed of 50 rpm, suitable for a wide range of applications.

No. of I/O Lines: 57

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1332-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

57

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1332-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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