Loading...

LM3S1162-EQC50-A2T

Texas Instruments

LM3S1162-EQC50-A2T by Texas Instruments

Texas Instruments LM3S1162-EQC50-A2T is a 32-bit microcontroller with 46 I/O lines, 16384 RAM bytes, and 65536 ROM words. Operating at up to 8.192 MHz, it is ideal for industrial applications requiring a wide temperature range (-40 to 105°C) and low power consumption (2.25-2.75V).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,586

-

-

-

-

Digiode

USA . 1,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,108

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 854 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

10k+ parts

-

854

$15.000

-

-

-

AZTECH Wire

Italy . 673 parts In-Stock

1+ parts

$16.788

100+ parts

-

1k+ parts

-

10k+ parts

-

673

$16.788

-

-

-

Parana Technologies

USA . 490 parts In-Stock

1+ parts

$46.329

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$46.329

-

-

-

Microchip USA

USA . 3,576 parts In-Stock

1+ parts

$50.420

100+ parts

$49.690

1k+ parts

$49.330

10k+ parts

$48.970

3,576

$50.420

$49.690

$49.330

$48.970

DigiPath Technology Company

USA . 776 parts In-Stock

1+ parts

$51.014

100+ parts

-

1k+ parts

-

10k+ parts

-

776

$51.014

-

-

-

ChromeModa Solutions

Germany . 4,722 parts In-Stock

1+ parts

$52.055

100+ parts

$42.685

1k+ parts

-

10k+ parts

-

4,722

$52.055

$42.685

-

-

IDEA Electronic Components Group

UK . 705 parts In-Stock

1+ parts

$52.055

100+ parts

$49.452

1k+ parts

$46.850

10k+ parts

-

705

$52.055

$49.452

$46.850

-

Component Stockers USA

USA . 333 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$99.990

-

-

-

Corphita

USA . 971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

971

-

-

-

-

Overview

Experience the unmatched quality and reliability of Texas Instruments with the LM3S1162-EQC50-A2T microcontroller. This innovative device offers a wide range of applications in various industries, providing exceptional performance and efficiency. With advanced features and cutting-edge technology, this product ensures seamless operation and enhanced functionality. Trust Texas Instruments to deliver top-notch solutions that add value to your projects and give you a competitive edge in the market. Elevate your designs with the LM3S1162-EQC50-A2T and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Makes the installation and assembly process easier and more efficient.

Maximum Supply Voltage: 2.75 V

Allows for stable and safe operation within the specified voltage range.

Package Shape: SQUARE

Square shape is compact and allows for efficient use of space on a circuit board.

Bit Size: 32

Provides enough processing power for various applications and tasks.

Power Supplies (V): 2.5,3.3

Offers flexibility in power options for different voltage requirements in a system.

No. of Terminals: 100

Sufficient terminals for connecting to various components and peripherals in a system.

Package Style (Meter): FLATPACK

Flatpack design provides a low profile and saves space on the circuit board.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower voltages within the specified range.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where higher operating temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it versatile for different environments.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance for the terminals.

ADC Channels: YES

Analog-to-digital converter channels allow for conversion of analog signals to digital data for processing.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection during installation.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

Low profile design helps in space-constrained applications and reduces overall height of the system.

Width: 14 mm

Compact width dimension for fitting into tight spaces on a circuit board.

Maximum Clock Frequency: 8.192 MHz

High clock frequency allows for fast processing and response times in the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature rating ensures reliable soldering and assembly of the microcontroller.

Length: 14 mm

Compact length dimension for optimizing space on a circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities for the microcontroller.

RAM Bytes: 16384

Ample RAM capacity for storing and accessing data during processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and soldering onto a circuit board.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance and operation of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast reprogramming of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and connectivity on a circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand standard moisture exposure during storage and handling.

Speed: 50 rpm

Provides information on the maximum operating speed of the microcontroller for efficient processing tasks.

No. of I/O Lines: 46

Sufficient I/O lines for interfacing with external devices and peripherals in a system.

Technical Specifications

Microcontrollers LM3S1162-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1162-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20