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LM3S1150-IQC50-A2T

Texas Instruments

LM3S1150-IQC50-A2T by Texas Instruments

LM3S1150-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with 52 I/O lines, 16384 RAM bytes, and 65536 ROM words. It operates in industrial temperatures (-40 to 85 °C) and features PWM channels for various applications. With a max clock frequency of 0.032 MHz, it is suitable for RISC-based systems requiring low power consumption.

Median Price

$13.380

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 950 parts In-Stock

1+ parts

$13.380

100+ parts

$13.110

1k+ parts

$12.840

10k+ parts

-

950

$13.380

$13.110

$12.840

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,149

-

-

-

-

Digiode

USA . 2,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,202

-

-

-

-

Chip Stock

USA . 625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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625

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$16.110

100+ parts

-

1k+ parts

-

10k+ parts

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442

$16.110

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-

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One Stop Electronics

USA . 1,328 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

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10k+ parts

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1,328

$17.000

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-

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Microchip USA

USA . 3,117 parts In-Stock

1+ parts

$51.360

100+ parts

$50.620

1k+ parts

$50.260

10k+ parts

$49.890

3,117

$51.360

$50.620

$50.260

$49.890

Parana Technologies

USA . 1,415 parts In-Stock

1+ parts

$52.351

100+ parts

-

1k+ parts

-

10k+ parts

-

1,415

$52.351

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-

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ChromeModa Solutions

Germany . 4,949 parts In-Stock

1+ parts

$58.821

100+ parts

$48.233

1k+ parts

-

10k+ parts

-

4,949

$58.821

$48.233

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IDEA Electronic Components Group

UK . 782 parts In-Stock

1+ parts

$58.821

100+ parts

$55.880

1k+ parts

$52.939

10k+ parts

-

782

$58.821

$55.880

$52.939

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Authorized Procurement Solutions

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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42,000

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DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

-

100+ parts

$53.033

1k+ parts

-

10k+ parts

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2,301

-

$53.033

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Corphita

USA . 277 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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277

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Overview

Experience the next level of innovation with the LM3S1150-IQC50-A2T microcontroller by Texas Instruments. Crafted with precision and expertise, Texas Instruments is renowned for delivering top-quality products that set industry standards. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and reliability. Unlock endless possibilities with advanced features and cutting-edge technology packed into a compact design. Elevate your projects with the LM3S1150-IQC50-A2T and discover the true meaning of value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to assemble on printed circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures proper operation and prevents damage to the microcontroller.

Package Shape: SQUARE

Square package shape allows for efficient use of space on PCBs and simplifies the layout design.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex calculations and process data faster.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows flexibility in system design and compatibility with different power sources.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile design that is ideal for space-constrained applications.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the microcontroller to function in harsh environments without overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance even in cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability for a reliable electrical connection.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices.

Terminal Position: QUAD

Quad terminal position allows for easy placement and soldering on the PCB, reducing assembly complexity.

ROM Words: 65536

Large ROM capacity of 65536 words provides ample storage for program code and data.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm allows for a compact and space-saving design.

Width: 14 mm

Narrow width of 14 mm makes the microcontroller suitable for applications with limited space constraints.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32 kHz enables fast processing and real-time control in the system.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for robust solder joints and long-term reliability.

Length: 14 mm

Compact length of 14 mm facilitates design flexibility and integration into various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller functionality provide efficient processing and control capabilities.

RAM Bytes: 16384

Ample RAM capacity of 16384 bytes allows for storing and manipulating data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable digital operation.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy soldering for reliable connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5 V ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals for motor control, lighting, and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast reprogramming of the microcontroller for firmware updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density packaging and miniaturization of the microcontroller in space-constrained designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 50 rpm

Speed rating of 50 rpm allows the microcontroller to operate efficiently in real-time applications and control systems.

No. of I/O Lines: 52

With 52 I/O lines, the microcontroller can interface with a wide range of external devices and peripherals for versatile connectivity options.

Technical Specifications

Microcontrollers LM3S1150-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1150-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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