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LM3S1138-IBZ50-A2

Texas Instruments

LM3S1138-IBZ50-A2 by Texas Instruments

LM3S1138-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at up to 8.192 MHz. It features 46 I/O lines, FLASH ROM programmability, and ADC channels. Ideal for industrial applications requiring a reliable and efficient microcontroller solution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,417 parts In-Stock

1+ parts

-

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7,417

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Digiode

USA . 4,381 parts In-Stock

1+ parts

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4,381

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,909 parts In-Stock

1+ parts

$1.209

100+ parts

-

1k+ parts

$1.160

10k+ parts

$1.160

3,909

$1.209

-

$1.160

$1.160

AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$7.140

100+ parts

-

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-

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500

$7.140

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One Stop Electronics

USA . 1,488 parts In-Stock

1+ parts

$16.000

100+ parts

-

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1,488

$16.000

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Microchip USA

USA . 1,166 parts In-Stock

1+ parts

$45.680

100+ parts

$45.020

1k+ parts

$44.700

10k+ parts

$44.370

1,166

$45.680

$45.020

$44.700

$44.370

Parana Technologies

USA . 799 parts In-Stock

1+ parts

$73.149

100+ parts

-

1k+ parts

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10k+ parts

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799

$73.149

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ChromeModa Solutions

Germany . 4,493 parts In-Stock

1+ parts

$82.190

100+ parts

$67.396

1k+ parts

-

10k+ parts

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4,493

$82.190

$67.396

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IDEA Electronic Components Group

UK . 1,120 parts In-Stock

1+ parts

$82.190

100+ parts

$78.080

1k+ parts

$73.971

10k+ parts

-

1,120

$82.190

$78.080

$73.971

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Component Stockers USA

USA . 600 parts In-Stock

1+ parts

$99.990

100+ parts

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600

$99.990

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Lixinc

USA . 2,673 parts In-Stock

1+ parts

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2,673

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Corphita

USA . 1,018 parts In-Stock

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1,018

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DigiPath Technology Company

USA . 769 parts In-Stock

1+ parts

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100+ parts

$74.103

1k+ parts

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10k+ parts

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769

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$74.103

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Overview

Discover the LM3S1138-IBZ50-A2 microcontroller by Texas Instruments, a powerful and reliable solution for a wide range of applications. With top-notch quality and advanced technology, Texas Instruments is a leading manufacturer in the industry. This versatile microcontroller offers customers unparalleled value with its high performance, low power consumption, and extensive features. Whether you're working on IoT devices, automation systems, or consumer electronics, the LM3S1138-IBZ50-A2 delivers exceptional results, making it the perfect choice for your next project. Upgrade your designs today with Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Makes it easier to integrate the microcontroller onto a circuit board, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

Allows for efficient power utilization and prevents damage from overvoltage.

Package Shape: SQUARE

Helps in easy alignment and placement on the circuit board.

Bit Size: 32

Enables efficient data processing and calculations.

Power Supplies (V): 2.5, 3.3

Offers flexibility in power options for different applications.

No. of Terminals: 108

Provides ample connectivity options for various external devices and components.

Package Style (Meter): GRID ARRAY

Enables efficient heat dissipation and electrical performance.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog signals to be converted to digital for processing, expanding the capabilities of the microcontroller.

Terminal Position: BOTTOM

Facilitates easy board layout and integration during assembly.

ROM Words: 65536

Provides ample storage for program instructions and data.

Maximum Seated Height: 1.5 mm

Compact size enables integration into space-constrained designs.

Width: 10 mm

Compact form factor suitable for small footprint applications.

Maximum Clock Frequency: 8.192 MHz

Offers high-speed processing capability for quick response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly process during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high temperatures during the reflow soldering process.

Length: 10 mm

Compact form factor suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and optimized processing.

RAM Bytes: 16384

Provides sufficient random access memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Facilitates reliable solder connections during assembly.

Nominal Supply Voltage: 2.5 V

Standard voltage for optimal performance and compatibility.

PWM Channels: YES

Enables precise control of analog signals for applications such as motor control and LED dimming.

ROM Programmability: FLASH

Allows for easy reprogramming of firmware and software updates.

Terminal Pitch: 0.8 mm

Efficient layout for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity requirements.

Speed: 50 rpm

Not typically used for rotational purposes, but can indicate processing speed.

No. of I/O Lines: 46

Provides plenty of input and output options for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S1138-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1138-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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