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LM3S1138-EQC50-A2

Texas Instruments

LM3S1138-EQC50-A2 by Texas Instruments

LM3S1138-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 46 I/O lines, 16384 RAM bytes, and 65536 ROM words. It operates in industrial temperatures (-40 to 105°C) and has a max clock frequency of 8.192 MHz. Ideal for applications requiring high-speed processing and extensive memory capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,291 parts In-Stock

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Digiode

USA . 1,888 parts In-Stock

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1,888

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Distributors (Availability)

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One Stop Electronics

USA . 1,062 parts In-Stock

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$5.000

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1,062

$5.000

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Ampacity Inc.

Singapore . 1,475 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 261 parts In-Stock

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$19.579

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261

$19.579

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Parana Technologies

USA . 492 parts In-Stock

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$30.557

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$69.174

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492

$30.557

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ChromeModa Solutions

Germany . 2,072 parts In-Stock

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$34.334

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$28.154

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2,072

$34.334

$28.154

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IDEA Electronic Components Group

UK . 878 parts In-Stock

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$34.334

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$32.617

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$30.901

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878

$34.334

$32.617

$30.901

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Microchip USA

USA . 2,021 parts In-Stock

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$48.710

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$47.860

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$47.440

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$47.010

2,021

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$47.010

Corphita

USA . 2,506 parts In-Stock

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DigiPath Technology Company

USA . 2,193 parts In-Stock

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$30.956

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Overview

Unlock the limitless possibilities of technology with the LM3S1138-EQC50-A2 microcontroller by Texas Instruments. Known for their top-quality products, Texas Instruments ensures that you get a reliable and efficient solution every time. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and functionality. Experience seamless operation, enhanced control, and endless innovation with the LM3S1138-EQC50-A2. Elevate your projects and surpass your goals with this cutting-edge microcontroller at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it a reliable choice for long-term use.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and prevents damage to the microcontroller, giving peace of mind to users.

Bit Size: 32

With a 32-bit size, this microcontroller offers high performance and processing capabilities, making it suitable for complex applications.

Package Style: FLATPACK

The flatpack package style allows for easy mounting and installation, making it user-friendly and convenient for integration into electronic systems.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to accurately convert analog signals to digital data, expanding its functionality and versatility.

ROM Words: 65536

With 65536 ROM words, this microcontroller has ample memory storage capacity for storing program instructions and data, making it suitable for diverse applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance, efficiency, and speed in executing instructions, making it an ideal choice for demanding tasks.

RAM Bytes: 16384

The 16384 RAM bytes provide sufficient memory for data storage and processing, ensuring smooth operation and improved performance of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation speed, making the microcontroller energy-efficient and reliable for various applications.

PWM Channels: YES

The availability of PWM channels allows for precise control of pulse-width modulation signals, enabling accurate regulation of motor speeds, LED brightness, and other applications.

Technical Specifications

Microcontrollers LM3S1138-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1138-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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