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LM3S1133-EQC50-A2

Texas Instruments

LM3S1133-EQC50-A2 by Texas Instruments

LM3S1133-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 44 I/O lines, 16KB RAM, and 64KB ROM. It operates at up to 8.192 MHz clock frequency and has ADC and PWM channels for industrial applications requiring high-speed processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,689 parts In-Stock

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7,689

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Digiode

USA . 4,683 parts In-Stock

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4,683

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Distributors (Availability)

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One Stop Electronics

USA . 133 parts In-Stock

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$8.000

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133

$8.000

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AZTECH Wire

Italy . 247 parts In-Stock

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$10.712

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247

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Parana Technologies

USA . 514 parts In-Stock

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$46.688

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514

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DigiPath Technology Company

USA . 134 parts In-Stock

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$51.409

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134

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ChromeModa Solutions

Germany . 1,159 parts In-Stock

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$52.458

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$43.016

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1,159

$52.458

$43.016

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IDEA Electronic Components Group

UK . 358 parts In-Stock

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$52.458

100+ parts

$49.835

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$47.212

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358

$52.458

$49.835

$47.212

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Corphita

USA . 2,198 parts In-Stock

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Microchip USA

USA . 330 parts In-Stock

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Overview

Unlock limitless possibilities with the LM3S1133-EQC50-A2 microcontroller from Texas Instruments. Experience unrivaled quality and reliability that only a trusted manufacturer like TI can provide. Perfect for a wide range of applications, this microcontroller offers unmatched value, benefits, and advantages to customers seeking cutting-edge technology. Trust in Texas Instruments to deliver premium products that exceed expectations every time. Elevate your projects to new heights with the LM3S1133-EQC50-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides durability and protection to the microcontroller, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design in PCB layouts.

Maximum Supply Voltage: 2.75 V

Operating with a maximum supply voltage of 2.75V ensures efficient power consumption and prevents potential damage to the microcontroller.

Bit Size: 32

32-bit architecture provides enhanced processing capability, making the microcontroller suitable for complex applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply options (2.5V and 3.3V) offers flexibility in design and compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals allows for sufficient I/O connections and peripheral interfaces, enabling versatile connectivity options.

ADC Channels: YES

Integrated ADC channels enable analog input processing, expanding the microcontroller's capabilities for sensor interfacing and data acquisition.

ROM Words: 65536

With 65536 ROM words, the microcontroller offers ample memory storage for program code and data storage requirements.

Maximum Clock Frequency: 8.192 MHz

Operating at a maximum clock frequency of 8.192 MHz, the microcontroller delivers high-speed performance for time-critical tasks and real-time processing.

RAM Bytes: 16384

Featuring 16384 RAM bytes, the microcontroller provides sufficient memory for data storage and temporary variable usage during program execution.

Technical Specifications

Microcontrollers LM3S1133-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

44

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1133-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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