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LM3S1110-EQC25-A2T

Texas Instruments

LM3S1110-EQC25-A2T by Texas Instruments

LM3S1110-EQC25-A2T by Texas Instruments is a 32-bit microcontroller with 41 I/O lines, 16384 RAM bytes, and 65536 ROM words. It operates in industrial temperatures (-40 to 105°C) and features ADC channels for analog input. This microcontroller is suitable for applications requiring high-speed processing and precise control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,283 parts In-Stock

1+ parts

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3,283

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Digiode

USA . 139 parts In-Stock

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139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,264 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,264

$5.000

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AZTECH Wire

Italy . 267 parts In-Stock

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$13.525

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267

$13.525

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Parana Technologies

USA . 510 parts In-Stock

1+ parts

$49.389

100+ parts

$4,586.496

1k+ parts

$44.450

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510

$49.389

$4,586.496

$44.450

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DigiPath Technology Company

USA . 741 parts In-Stock

1+ parts

$54.383

100+ parts

$50.032

1k+ parts

-

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741

$54.383

$50.032

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ChromeModa Solutions

Germany . 3,089 parts In-Stock

1+ parts

$55.493

100+ parts

$45.504

1k+ parts

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3,089

$55.493

$45.504

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IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$55.493

100+ parts

$52.718

1k+ parts

$49.944

10k+ parts

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709

$55.493

$52.718

$49.944

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Corphita

USA . 1,091 parts In-Stock

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1,091

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Microchip USA

USA . 206 parts In-Stock

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206

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Overview

Enhance your electronic projects with the Texas Instruments LM3S1110-EQC25-A2T microcontroller, a high-quality product designed to meet your specific needs. Manufactured by industry leader Texas Instruments, this microcontroller offers unmatched reliability and performance. Perfect for a wide range of applications, this microcontroller provides value through its versatile features and benefits. From industrial automation to consumer electronics, the LM3S1110-EQC25-A2T delivers seamless operation and efficiency, making it the ideal choice for your next project. Unlock endless possibilities with this powerful microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall product size.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protects the microcontroller from overvoltage damage.

Package Shape: SQUARE

The square shape of the package allows for easier integration into circuit designs and offers a more compact footprint.

Bit Size: 32

A 32-bit microcontroller provides higher processing power and performance compared to lower bit sizes, making it suitable for a wide range of applications.

Power Supplies (V): 2.5,3.3

Having multiple power supply options (2.5V and 3.3V) allows for flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 100

The large number of terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

The flatpack style of packaging offers a low profile, which is beneficial for space-constrained applications or designs.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C makes the microcontroller suitable for industrial environments where elevated temperatures may be present.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, enabling a wider range of sensing and control capabilities.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection for interfacing with external devices or connectors.

ROM Words: 65536

With a ROM capacity of 65536 words, the microcontroller can store a large amount of program data and instructions.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for compact and slim device designs.

Width: 14 mm

The 14 mm width offers a balance between space efficiency and ease of handling during assembly and installation.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32 MHz allows for faster processing speed and responsiveness in real-time applications.

Length: 14 mm

The 14 mm length contributes to the overall compact size of the microcontroller, making it suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically encountered in industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers efficient data processing and instruction execution, ideal for applications requiring high-speed performance.

RAM Bytes: 16384

With a RAM capacity of 16384 bytes, the microcontroller can efficiently store and process data during operation.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making it an energy-efficient choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form offers a secure and reliable connection during soldering and assembly processes.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures stable and consistent performance under typical operating conditions.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, making the microcontroller suitable for applications requiring accurate voltage or current modulation.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy and efficient firmware updates and reprogramming without the need for external programming tools.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density PCB design and compact layout, optimizing space usage and increasing design flexibility.

Speed: 25 rpm

The speed of 25 revolutions per minute (rpm) indicates the maximum clock frequency or processing speed of the microcontroller, ensuring efficient data processing and real-time responsiveness.

No. of I/O Lines: 41

The 41 I/O lines provide ample input and output connectivity options, allowing the microcontroller to interface with a wide range of sensors, actuators, and communication devices.

Technical Specifications

Microcontrollers LM3S1110-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

41

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1110-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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