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LM3S102-IQN20-C2T

Texas Instruments

LM3S102-IQN20-C2T by Texas Instruments

LM3S102-IQN20-C2T by Texas Instruments is a 32-bit microcontroller with 2048 bytes of RAM and 8192 ROM words. Operating at a max clock frequency of 0.032 MHz, it features 18 I/O lines and PWM channels for industrial applications requiring high-speed processing and control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,758 parts In-Stock

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7,758

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Digiode

USA . 3,721 parts In-Stock

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3,721

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Distributors (Availability)

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AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$17.000

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856

$17.000

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One Stop Electronics

USA . 1,261 parts In-Stock

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$20.000

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1,261

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Microchip USA

USA . 4,124 parts In-Stock

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$22.680

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$22.540

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$22.470

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$22.400

4,124

$22.680

$22.540

$22.470

$22.400

Parana Technologies

USA . 696 parts In-Stock

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$26.908

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$29.927

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696

$26.908

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$29.927

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DigiPath Technology Company

USA . 1,451 parts In-Stock

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$29.629

100+ parts

$27.259

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1,451

$29.629

$27.259

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ChromeModa Solutions

Germany . 4,742 parts In-Stock

1+ parts

$30.234

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$24.792

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4,742

$30.234

$24.792

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IDEA Electronic Components Group

UK . 2,200 parts In-Stock

1+ parts

$30.234

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$28.722

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$27.211

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2,200

$30.234

$28.722

$27.211

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Corphita

USA . 4,369 parts In-Stock

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4,369

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Overview

Experience the cutting-edge technology of the LM3S102-IQN20-C2T microcontroller by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers top-notch performance and reliability in every product. This microcontroller is versatile and ideal for a wide range of applications, offering customers incredible value and benefits. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, the LM3S102-IQN20-C2T provides unmatched power and efficiency to bring your projects to life. Elevate your designs with this innovative microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller.

Surface Mount: YES

Allows for easy and secure installation on PCBs.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, suitable for various applications.

Bit Size: 32

Offers a high bit size for handling complex operations and calculations.

Power Supplies (V): 3.3

Stable power supply at 3.3V for consistent performance.

No. of Terminals: 48

Sufficient terminals for connecting to other components and peripherals.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures, suitable for industrial environments.

ADC Channels: YES

Integration of Analog-to-Digital Converter channels for capturing analog signals.

ROM Words: 8192

Large ROM capacity for storing program instructions and data.

Maximum Clock Frequency: 0.032 MHz

Can operate at a high clock frequency suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control of peripherals.

RAM Bytes: 2048

Adequate RAM size for temporary data storage during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Maximum Supply Current: 50 mA

Low supply current requirement for energy-efficient operation.

PWM Channels: YES

Support for Pulse-Width Modulation channels for precise control of analog devices.

Technical Specifications

Microcontrollers LM3S102-IQN20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S102-IQN20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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