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LM3S101-IGZ20-C2T

Texas Instruments

LM3S101-IGZ20-C2T by Texas Instruments

Texas Instruments LM3S101-IGZ20-C2T is a 32-bit microcontroller with 3.3V power supply, 2048 bytes RAM, and 8192 ROM words. Ideal for industrial applications, it features ADC channels, PWM support, and operates at temperatures ranging from -40 to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,188 parts In-Stock

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3,188

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Digiode

USA . 2,124 parts In-Stock

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2,124

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Distributors (Availability)

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AZTECH Wire

Italy . 408 parts In-Stock

1+ parts

$15.907

100+ parts

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408

$15.907

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One Stop Electronics

USA . 1,636 parts In-Stock

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$30.000

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1,636

$30.000

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Parana Technologies

USA . 2,342 parts In-Stock

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$63.125

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2,342

$63.125

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DigiPath Technology Company

USA . 377 parts In-Stock

1+ parts

$69.508

100+ parts

$63.948

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377

$69.508

$63.948

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ChromeModa Solutions

Germany . 6,354 parts In-Stock

1+ parts

$70.927

100+ parts

$58.160

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6,354

$70.927

$58.160

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IDEA Electronic Components Group

UK . 1,073 parts In-Stock

1+ parts

$70.927

100+ parts

$67.381

1k+ parts

$63.834

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1,073

$70.927

$67.381

$63.834

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Microchip USA

USA . 2,251 parts In-Stock

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Corphita

USA . 125 parts In-Stock

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Overview

Enhance your projects with the LM3S101-IGZ20-C2T by Texas Instruments, a high-quality microcontroller that offers unparalleled performance and reliability. Manufactured by a trusted industry leader, this advanced device is perfect for a wide range of applications, from automotive to industrial automation. With its cutting-edge technology and innovative features, this microcontroller provides customers with exceptional value and benefits, making it the ideal choice for any project that requires precision and efficiency. Discover the advantages of the LM3S101-IGZ20-C2T today and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good strength and durability to the microcontroller package, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a range of electronic components.

Package Shape: SQUARE

The square package shape helps in efficient placement and mounting on circuit boards, optimizing space utilization in electronic devices.

Bit Size: 32

The 32-bit architecture offers enhanced processing capabilities and efficiency, making the microcontroller suitable for advanced applications and tasks.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V ensures compatibility with commonly used power sources and components, simplifying system integration.

No. of Terminals: 48

With a higher number of terminals, the microcontroller provides more connectivity options and flexibility in interfacing with external devices or peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and slim profile, ideal for space-constrained applications where size and form factor are critical.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and operation, especially in battery-powered or energy-sensitive applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance in harsh environments or industrial settings with elevated temperatures.

Minimum Operating Temperature: -40 °C

With a wide temperature range, the microcontroller can withstand cold conditions without compromising functionality, suitable for various operating environments.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to process analog signals, making it versatile for sensor interfacing and data acquisition.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection on the circuit board, reducing the risk of signal interference or disconnection.

ROM Words: 8192

With a large ROM capacity of 8192 words, the microcontroller can store and execute a significant amount of program instructions and data, enhancing its versatility.

Maximum Seated Height: 1 mm

The low seated height of 1mm saves space and allows for a more compact design when integrating the microcontroller into electronic devices or systems.

Width: 6.875 mm

The narrow width of 6.875mm facilitates compact PCB layouts and enables high-density integration of multiple components, optimizing space usage.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032MHz indicates the microcontroller's fast processing speed and efficiency in executing instructions and tasks.

Length: 6.875 mm

The compact length of 6.875mm contributes to the microcontroller's overall small form factor, ideal for applications with size limitations or constraints.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance and stability in demanding industrial applications, where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with a Reduced Instruction Set Computing (RISC) architecture offers efficient processing and execution of instructions, enhancing overall performance.

RAM Bytes: 2048

The generous RAM size of 2048 bytes allows for efficient data storage and manipulation during program execution, improving processing speed and performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and dependable.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder connections and reliable electrical contact, ensuring robust performance and stability in various operating conditions.

Maximum Supply Current: 50 mA

The maximum supply current of 50mA indicates low power consumption and efficient operation, suitable for applications requiring energy efficiency and long battery life.

Nominal Supply Voltage: 3.3 V

The standard nominal supply voltage of 3.3V ensures compatibility with most electronic components and power sources, simplifying system design and integration.

PWM Channels: YES

The presence of Pulse-Width Modulation (PWM) channels enables precise control of analog signals and motor speed, making the microcontroller versatile for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware and software, enhancing the microcontroller's versatility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting and precise solder connections, contributing to reliable performance and robust electrical connections.

Speed: 20 rpm

The operational speed of 20 rotations per minute (rpm) indicates the microcontroller's processing capabilities and efficiency in controlling applications that require variable speeds.

No. of I/O Lines: 18

With 18 Input/Output (I/O) lines, the microcontroller offers ample connectivity for interfacing with external devices and peripherals, enhancing its versatility and functionality.

Technical Specifications

Microcontrollers LM3S101-IGZ20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

6.875 mm

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S101-IGZ20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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