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HPA01197RGER

Texas Instruments

HPA01197RGER by Texas Instruments

Texas Instruments' HPA01197RGER is a Power Management IC with 24 terminals in a square chip carrier package. Operating from -40 to 85°C, it supports supply voltages from 3.9V to 17V and features an adjustable threshold for BUCK switcher configuration. Ideal for industrial applications requiring precise power supply management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,192 parts In-Stock

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5,192

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Digiode

USA . 3,976 parts In-Stock

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3,976

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

1+ parts

$1.500

100+ parts

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1,406

$1.500

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Semicontronic

India . 1,071 parts In-Stock

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$1.500

100+ parts

$1.462

1k+ parts

$1.455

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1,071

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 149 parts In-Stock

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$3.500

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149

$3.500

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Parana Technologies

USA . 1,835 parts In-Stock

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$12.730

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$13.195

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1,835

$12.730

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$13.195

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DigiPath Technology Company

USA . 1,772 parts In-Stock

1+ parts

$14.017

100+ parts

$12.896

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1,772

$14.017

$12.896

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ChromeModa Solutions

Germany . 2,209 parts In-Stock

1+ parts

$14.303

100+ parts

$11.728

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2,209

$14.303

$11.728

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IDEA Electronic Components Group

UK . 2,142 parts In-Stock

1+ parts

$14.303

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$13.588

1k+ parts

$12.873

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2,142

$14.303

$13.588

$12.873

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AZTECH Wire

Italy . 361 parts In-Stock

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$14.482

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361

$14.482

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Corphita

USA . 4,082 parts In-Stock

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4,082

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Microchip USA

USA . 2,070 parts In-Stock

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2,070

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Corohmni

South Africa . 353 parts In-Stock

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353

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Overview

Power up your devices with the high-quality HPA01197RGER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable Power Management ICs that are perfect for various applications. This chip carrier with heat sink/slug and very thin profile is designed for industrial use and offers a wide operating temperature range. With features like adjustable threshold voltage and buck switcher configuration, this product provides unparalleled value and performance for your power supply management needs. Trust Texas Instruments to deliver top-notch quality and innovation in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the Power Management IC, making it suitable for a variety of industrial applications.

Surface Mount: YES

The ability for surface mounting allows for easy and efficient installation of the Power Management IC onto circuit boards, saving time and effort during production.

No. of Terminals: 24

With a higher number of terminals, this Power Management IC can handle complex power distribution and management tasks, offering versatility in design and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in challenging environments where temperature fluctuations are common.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of Nickel/Palladium/Gold terminal finish enhances conductivity and corrosion resistance, prolonging the lifespan of the Power Management IC.

Minimum Supply Voltage (Vsup): 3.9 V

With a low minimum supply voltage, this Power Management IC can efficiently regulate power even in low voltage scenarios, making it suitable for a wide range of applications.

Switcher Config: BUCK

The BUCK switcher configuration allows for efficient step-down voltage regulation, enabling the Power Management IC to deliver stable power output with high efficiency.

Technical Specifications

Power Management ICs HPA01197RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.8V

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

3.9 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

HPA01197RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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