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HPA00489DRVR

Texas Instruments

HPA00489DRVR by Texas Instruments

Texas Instruments' HPA00489DRVR is a Power Management IC with 3.3V nominal voltage, suitable for automotive applications. Featuring a small outline package style and adjustable threshold, it operates b/w -40 to 125°C temperature range. With surface mount capability and 6 terminals, it offers reliable power supply support in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,263 parts In-Stock

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6,263

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Digiode

USA . 4,882 parts In-Stock

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4,882

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Distributors (Availability)

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One Stop Electronics

USA . 252 parts In-Stock

1+ parts

$3.500

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252

$3.500

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Parana Technologies

USA . 1,678 parts In-Stock

1+ parts

$5.202

100+ parts

-

1k+ parts

$5.812

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1,678

$5.202

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$5.812

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Semicontronic

India . 749 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

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$5.335

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749

$5.500

$5.362

$5.335

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ChromeModa Solutions

Germany . 2,163 parts In-Stock

1+ parts

$5.845

100+ parts

$4.793

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2,163

$5.845

$4.793

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IDEA Electronic Components Group

UK . 1,595 parts In-Stock

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$5.845

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$5.260

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1,595

$5.845

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$5.260

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Ampacity Inc.

Singapore . 530 parts In-Stock

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$6.500

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530

$6.500

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AZTECH Wire

Italy . 566 parts In-Stock

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$10.910

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566

$10.910

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Microchip USA

USA . 121 parts In-Stock

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$18.690

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$18.560

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$18.560

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$18.420

121

$18.690

$18.560

$18.560

$18.420

Corphita

USA . 878 parts In-Stock

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878

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DigiPath Technology Company

USA . 606 parts In-Stock

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$5.270

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606

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$5.270

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Corohmni

South Africa . 417 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the HPA00489DRVR power management IC. Designed for automotive applications, this small outline, heat sink profile IC offers a wide supply voltage range and adjustable threshold, making it ideal for various power supply support circuits. With Texas Instruments' renowned reputation for excellence, you can trust that this product delivers exceptional performance and efficiency. Upgrade your power management system today and enjoy the benefits of cutting-edge technology with the HPA00489DRVR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and making manufacturing more efficient.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V nominal supply voltage is a common standard in many electronic devices, ensuring compatibility with various systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this power management IC can function reliably in high temperature environments.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures down to -40 °C makes this IC suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certifies that this IC meets industry standards for performance in automotive applications, ensuring reliability and safety.

Adjustable Threshold: YES

Adjustable threshold feature allows for fine-tuning of voltage thresholds, providing flexibility in power management settings.

Technical Specifications

Power Management ICs HPA00489DRVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

HPA00489DRVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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