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HPA01011DRZR

Texas Instruments

HPA01011DRZR by Texas Instruments

Texas Instruments' HPA01011DRZR is a Power Management IC with 12 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and features a small outline package suitable for industrial applications requiring precise power supply management circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,310 parts In-Stock

1+ parts

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4,310

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Vyrian

USA . 3,474 parts In-Stock

1+ parts

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3,474

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,431 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,431

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,019 parts In-Stock

1+ parts

$2.500

100+ parts

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1,019

$2.500

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Parana Technologies

USA . 1,462 parts In-Stock

1+ parts

$2.698

100+ parts

-

1k+ parts

$3.180

10k+ parts

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1,462

$2.698

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$3.180

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DigiPath Technology Company

USA . 925 parts In-Stock

1+ parts

$2.970

100+ parts

$2.733

1k+ parts

-

10k+ parts

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925

$2.970

$2.733

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ChromeModa Solutions

Germany . 2,950 parts In-Stock

1+ parts

$3.031

100+ parts

$2.485

1k+ parts

-

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2,950

$3.031

$2.485

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IDEA Electronic Components Group

UK . 2,194 parts In-Stock

1+ parts

$3.031

100+ parts

-

1k+ parts

$2.728

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2,194

$3.031

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$2.728

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AZTECH Wire

Italy . 507 parts In-Stock

1+ parts

$7.106

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507

$7.106

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Ampacity Inc.

Singapore . 1,548 parts In-Stock

1+ parts

$7.500

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1,548

$7.500

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Corphita

USA . 2,736 parts In-Stock

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2,736

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Corohmni

South Africa . 388 parts In-Stock

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388

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Overview

Maximize efficiency and reliability with the HPA01011DRZR from Texas Instruments. This Power Management IC offers top-notch quality and performance, making it a standout choice for various applications. With a focus on power supply management, this product ensures seamless operation and optimal functionality. Trust in Texas Instruments' reputation for excellence and innovation, and experience the unparalleled benefits and value that the HPA01011DRZR brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage for efficient power management and performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and durability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term functionality.

Width (mm): 2.5 mm

Small width makes it suitable for compact applications where space is limited.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring consistent performance under harsh conditions.

Technical Specifications

Power Management ICs HPA01011DRZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

HPA01011DRZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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