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HPA00744PWR

Texas Instruments

HPA00744PWR by Texas Instruments

Texas Instruments HPA00744PWR is a Power Management IC with 20 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.4V to 2.6V and peak reflow temperature of 260°C. Ideal for industrial applications requiring compact design and efficient power supply management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,204 parts In-Stock

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Digiode

USA . 4,261 parts In-Stock

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4,261

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Distributors (Availability)

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One Stop Electronics

USA . 759 parts In-Stock

1+ parts

$3.500

100+ parts

-

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759

$3.500

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Semicontronic

India . 539 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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539

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 1,366 parts In-Stock

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$4.500

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1,366

$4.500

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Parana Technologies

USA . 774 parts In-Stock

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$9.783

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$10.356

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774

$9.783

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$10.356

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AZTECH Wire

Italy . 495 parts In-Stock

1+ parts

$10.715

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495

$10.715

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ChromeModa Solutions

Germany . 6,580 parts In-Stock

1+ parts

$10.992

100+ parts

$9.013

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6,580

$10.992

$9.013

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IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$10.992

100+ parts

$10.442

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$9.893

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749

$10.992

$10.442

$9.893

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Microchip USA

USA . 3,350 parts In-Stock

1+ parts

$28.700

100+ parts

$28.290

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$28.090

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$27.880

3,350

$28.700

$28.290

$28.090

$27.880

DigiPath Technology Company

USA . 870 parts In-Stock

1+ parts

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$9.910

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870

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$9.910

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Corphita

USA . 705 parts In-Stock

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705

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Corohmni

South Africa . 79 parts In-Stock

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Overview

Discover the power of Texas Instruments with the HPA00744PWR Power Management IC. Designed with precision and reliability in mind, this product offers unparalleled performance for a wide range of applications. From industrial to consumer electronics, this innovative solution ensures optimal power supply management with ease. Trust in the quality and expertise of Texas Instruments to deliver cutting-edge technology that meets your needs. Elevate your designs with the HPA00744PWR and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 2.5 V

Operates at an optimal supply voltage for efficient power management.

No. of Terminals: 20

Sufficient number of terminals for connecting various components in the circuit.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, suitable for industrial applications.

Width (mm): 4.4 mm

Compact width allows for space-saving designs in electronic systems.

Minimum Supply Voltage (Vsup): 2.4 V

Operates efficiently even at lower supply voltages, reducing power consumption.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and ease of soldering during assembly.

Maximum Supply Voltage (Vsup): 2.6 V

With a maximum supply voltage of 2.6V, this IC can handle voltage fluctuations without damage.

Technical Specifications

Power Management ICs HPA00744PWR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

HPA00744PWR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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