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HPA00900AIDCNR

Texas Instruments

HPA00900AIDCNR by Texas Instruments

Texas Instruments' HPA00900AIDCNR is a Power Management IC with 3.3V supply voltage, 8 terminals, and 1mA max supply current. Ideal for power supply support circuits, it features a small outline package with dual-positioned gull wing terminals suitable for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,655 parts In-Stock

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6,655

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Digiode

USA . 4,456 parts In-Stock

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4,456

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Distributors (Availability)

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Semicontronic

India . 408 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

408

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 460 parts In-Stock

1+ parts

$7.500

100+ parts

-

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460

$7.500

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AZTECH Wire

Italy . 315 parts In-Stock

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$13.625

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315

$13.625

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Parana Technologies

USA . 506 parts In-Stock

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$15.336

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$15.729

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506

$15.336

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$15.729

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DigiPath Technology Company

USA . 2,083 parts In-Stock

1+ parts

$16.886

100+ parts

$15.535

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2,083

$16.886

$15.535

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IDEA Electronic Components Group

UK . 1,637 parts In-Stock

1+ parts

$17.231

100+ parts

$16.369

1k+ parts

$15.508

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1,637

$17.231

$16.369

$15.508

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ChromeModa Solutions

Germany . 308 parts In-Stock

1+ parts

$17.231

100+ parts

$14.129

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308

$17.231

$14.129

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Lixinc

USA . 18,035 parts In-Stock

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Corphita

USA . 2,764 parts In-Stock

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2,764

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Kepictronics

USA . 325 parts In-Stock

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Corohmni

South Africa . 316 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the HPA00900AIDCNR from Texas Instruments, a leading manufacturer in Power Management ICs. This small outline, low profile package is designed for maximum efficiency and performance, making it ideal for various power supply support circuits. With a nominal supply voltage of 3.3V and a dual terminal position, this IC offers unmatched precision and stability. Experience the benefits of superior design and cutting-edge technology with the HPA00900AIDCNR, providing customers with value and peace of mind for all their power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in Power Management ICs due to its durability and heat resistance, making it a reliable choice for electronic components.

Surface Mount: YES

Surface mount technology offers better space utilization and lower production costs compared to through-hole mounting, making the product more efficient and cost-effective.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this Power Management IC can operate efficiently in a wide range of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over an extended period of time.

Width (mm): 1.6 mm

The compact width of 1.6mm allows for space-saving design and integration, making the product suitable for applications with limited board space.

Nominal Threshold Voltage (V): +2V

A nominal threshold voltage of +2V ensures stable operation and precise voltage regulation, making the Power Management IC suitable for critical power supply applications.

Maximum Supply Current (Isup): 1 mA

The low maximum supply current of 1mA indicates efficient power consumption, making the product ideal for battery-powered devices or applications requiring low power consumption.

Technical Specifications

Power Management ICs HPA00900AIDCNR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

HPA00900AIDCNR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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