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HPA00742DBTR

Texas Instruments

HPA00742DBTR by Texas Instruments

Texas Instruments' HPA00742DBTR is a Power Management IC with 30 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.4V to 2.6V and features adjustable threshold levels. The IC is designed for industrial applications requiring precise power supply management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,310 parts In-Stock

1+ parts

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7,310

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Digiode

USA . 5,000 parts In-Stock

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5,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 686 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

686

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 134 parts In-Stock

1+ parts

$2.500

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134

$2.500

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One Stop Electronics

USA . 1,102 parts In-Stock

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$4.500

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1,102

$4.500

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AZTECH Wire

Italy . 490 parts In-Stock

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$8.349

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490

$8.349

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Parana Technologies

USA . 1,585 parts In-Stock

1+ parts

$16.438

100+ parts

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$16.733

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1,585

$16.438

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$16.733

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ChromeModa Solutions

Germany . 3,195 parts In-Stock

1+ parts

$18.470

100+ parts

$15.145

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3,195

$18.470

$15.145

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IDEA Electronic Components Group

UK . 1,648 parts In-Stock

1+ parts

$18.470

100+ parts

$17.546

1k+ parts

$16.623

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1,648

$18.470

$17.546

$16.623

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DigiPath Technology Company

USA . 2,023 parts In-Stock

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$16.653

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2,023

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$16.653

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Corphita

USA . 186 parts In-Stock

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186

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Corohmni

South Africa . 60 parts In-Stock

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60

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Overview

Elevate your power management with the HPA00742DBTR by Texas Instruments, a top-tier manufacturer known for quality and reliability. Designed for industrial-grade applications, this Power Management IC offers unmatched performance and efficiency. With a compact package style and adjustable threshold feature, this IC is perfect for a wide range of electronic devices. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Experience the difference with the HPA00742DBTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and installation.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and reducing production costs.

Nominal Supply Voltage (Vsup): 2.5 V

The nominal supply voltage of 2.5 V ensures stable and efficient power management for the device.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh industrial environments.

Width (mm): 4.4 mm

The compact width of 4.4 mm saves space on the PCB and allows for efficient placement in tight layouts.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this product is designed to efficiently manage and regulate power supply, ensuring stable operation of electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures that the product can withstand reflow soldering processes without damage.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the product is moderately sensitive to moisture, allowing for safe storage and handling in standard manufacturing environments.

Technical Specifications

Power Management ICs HPA00742DBTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

HPA00742DBTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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