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HPA00729PWR

Texas Instruments

HPA00729PWR by Texas Instruments

HPA00729PWR by Texas Instruments is a Power Management IC with 20 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.4V to 2.6V and features an adjustable threshold for power supply management circuits. This rectangular package with small outline and thin profile is ideal for industrial applications requiring precise voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,695 parts In-Stock

1+ parts

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3,695

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Digiode

USA . 2,749 parts In-Stock

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2,749

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 822 parts In-Stock

1+ parts

$1.703

100+ parts

-

1k+ parts

$2.298

10k+ parts

-

822

$1.703

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$2.298

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DigiPath Technology Company

USA . 2,013 parts In-Stock

1+ parts

$1.876

100+ parts

$1.726

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-

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2,013

$1.876

$1.726

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IDEA Electronic Components Group

UK . 1,892 parts In-Stock

1+ parts

$1.914

100+ parts

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$1.723

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1,892

$1.914

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$1.723

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ChromeModa Solutions

Germany . 11 parts In-Stock

1+ parts

$1.914

100+ parts

$1.569

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11

$1.914

$1.569

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One Stop Electronics

USA . 235 parts In-Stock

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$4.500

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235

$4.500

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Ampacity Inc.

Singapore . 1,162 parts In-Stock

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$5.500

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1,162

$5.500

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Semicontronic

India . 682 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

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$7.275

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682

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 616 parts In-Stock

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$19.672

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616

$19.672

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Corphita

USA . 3,783 parts In-Stock

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3,783

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Corohmni

South Africa . 68 parts In-Stock

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Overview

Power up your devices with the HPA00729PWR by Texas Instruments, a top-notch Power Management IC that guarantees quality and reliability. Designed for industrial applications, this compact chip offers superior performance and efficiency. With a wide operating temperature range and adjustable threshold, this IC is perfect for various power supply management circuits. Trust Texas Instruments to deliver cutting-edge solutions that meet your power management needs. Choose the HPA00729PWR for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the Power Management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Nominal Supply Voltage (Vsup): 2.5 V

Stable nominal supply voltage ensures reliable performance and consistency in power management.

No. of Terminals: 20

Having 20 terminals provides flexibility in connection options for different circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes this Power Management IC suitable for industrial applications where heat may be a concern.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish offers good conductivity and corrosion resistance for reliable connections.

Width (mm): 4.4 mm

Compact width size allows for space-saving and efficient PCB layout designs.

Minimum Supply Voltage (Vsup): 2.4 V

Having a low minimum supply voltage ensures compatibility with a wide range of power input sources.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust soldering processes during PCB assembly.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh environmental conditions.

Technical Specifications

Power Management ICs HPA00729PWR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

HPA00729PWR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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