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FPF2165

Onsemi

FPF2165 by Onsemi

FPF2165 by Onsemi is a Power Management IC with 6 terminals, operating voltage range of 1.8V to 5.5V, and adjustable threshold feature. It is designed for industrial applications, with a small outline package shape and very thin profile suitable for surface mount assembly. The IC supports power supply circuits in temperature ranges from -40°C to 85°C.

Median Price

$0.916

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

$0.633

100+ parts

$0.595

1k+ parts

$0.538

10k+ parts

-

3,000

$0.633

$0.595

$0.538

-

Mouser Electronics

USA . 8,091 parts In-Stock

1+ parts

$1.200

100+ parts

$0.697

1k+ parts

$0.605

10k+ parts

-

8,091

$1.200

$0.697

$0.605

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DigiKey

USA . 2,613 parts In-Stock

1+ parts

$1.200

100+ parts

$0.696

1k+ parts

$0.605

10k+ parts

$0.559

2,613

$1.200

$0.696

$0.605

$0.559

Verical

USA . 9,000 parts In-Stock

1+ parts

-

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$0.556

9,000

-

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$0.556

Distributors (In-Stock)

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Digiode

USA . 592 parts In-Stock

1+ parts

$0.601

100+ parts

-

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592

$0.601

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Flip Electronics

USA . 6,859 parts In-Stock

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6,859

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 2,213 parts In-Stock

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2,213

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Cyclops Electronics Ltd

UK . 1,037 parts In-Stock

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1,037

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Sensible Micro Corp

USA . 102 parts In-Stock

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102

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Prism Electronics

USA . 77 parts In-Stock

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77

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Nova Conductors

Japan . 10 parts In-Stock

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10

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,653 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,653

$0.540

-

-

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Corphita

USA . 1,245 parts In-Stock

1+ parts

$0.570

100+ parts

-

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1,245

$0.570

-

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Corohmni

South Africa . 455 parts In-Stock

1+ parts

$0.633

100+ parts

-

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455

$0.633

-

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Semicontronic

India . 2,606 parts In-Stock

1+ parts

$1.170

100+ parts

$1.141

1k+ parts

$1.135

10k+ parts

-

2,606

$1.170

$1.141

$1.135

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Aztec Data Supply Inc.

USA . 4,211 parts In-Stock

1+ parts

$10.690

100+ parts

-

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4,211

$10.690

-

-

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$10.732

100+ parts

$10.195

1k+ parts

$10.195

10k+ parts

-

150

$10.732

$10.195

$10.195

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RC Electronics

USA . 75,098 parts In-Stock

1+ parts

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75,098

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Metaverse IC Inc.

Canada . 73,729 parts In-Stock

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73,729

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QUARKTWIN TECHNOLOGY LTD

USA . 27,812 parts In-Stock

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27,812

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Lixinc

USA . 17,238 parts In-Stock

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17,238

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A-Z Elektronik GmbH

Germany . 11,358 parts In-Stock

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11,358

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TANS Electronics

Latvia . 5,568 parts In-Stock

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5,568

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Kepictronics

USA . 5,438 parts In-Stock

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5,438

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Kulean Microsystems

USA . 5,019 parts In-Stock

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5,019

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Microchip USA

USA . 4,765 parts In-Stock

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4,765

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Assy Fe

Spain . 2,070 parts In-Stock

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2,070

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Alle Elektronik GmbH

Germany . 1,572 parts In-Stock

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1,572

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Continental Prestige Electronics

USA . 1,385 parts In-Stock

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1,385

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Problanco Electronics

Mexico . 1,368 parts In-Stock

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1,368

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SupplyDigital Components

Austria . 1,204 parts In-Stock

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1,204

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Supply Digital

USA . 668 parts In-Stock

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668

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

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300

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iodParts Technologies Inc.

India . 77 parts In-Stock

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77

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Argo Parts USA

USA . 73 parts In-Stock

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73

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UHIMA Technologies

Türkiye . 62 parts In-Stock

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62

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Overview

Upgrade your power management system with the FPF2165 by Onsemi, a high-quality Power Management IC designed to meet your specific needs. With its surface mount capabilities and small outline package style, this versatile component is perfect for a wide range of applications. Experience the reliability and efficiency of Onsemi's manufacturing expertise, providing you with peace of mind knowing your system is in good hands. Say goodbye to power-related issues and hello to seamless performance with the FPF2165. Discover the value and benefits this product brings to your projects today.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

The square shape makes this IC compact and space-saving, ideal for applications where board space is limited.

Nominal Supply Voltage (Vsup): 3.3 V

With a stable supply voltage, this IC ensures consistent and reliable performance in various power management applications.

No. of Terminals: 6

The 6 terminals offer versatility in connecting to other components, increasing the flexibility of the overall circuit design.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style enhances thermal performance and minimizes space requirements, making it suitable for compact devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can withstand demanding environmental conditions, improving reliability.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IC can perform in extreme cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and simplify the connection to other components.

Maximum Seated Height: 0.8 mm

The low seated height helps in achieving a slim profile for the overall PCB design, suitable for space-constrained applications.

Width (mm): 2 mm

The compact width of 2mm allows for a compact and efficient PCB layout, saving valuable board space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC is designed to support power supply functions, making it perfect for various power management applications.

Minimum Supply Voltage (Vsup): 1.8 V

With a low minimum supply voltage, this IC is suitable for battery-powered devices, extending battery life.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time reduces the risk of thermal damage during soldering, ensuring the IC's reliability.

Peak Reflow Temperature °C: 260

This high peak reflow temperature makes the IC compatible with lead-free soldering processes, meeting RoHS standards.

Length: 2 mm

The compact length of 2mm contributes to a space-saving design, ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the IC can operate in harsh industrial environments with high reliability.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder bridging during assembly, simplifying the manufacturing process.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density PCB layouts, perfect for miniaturized designs.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this IC can handle various input voltage levels, increasing compatibility with different power sources.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of circuit parameters, enabling flexibility in power management applications.

Technical Specifications

Power Management ICs FPF2165 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

FPF2165 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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