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FCT162244CTPACTE4

Texas Instruments

FCT162244CTPACTE4 by Texas Instruments

FCT162244CTPACTE4 by Texas Instruments is a 48-terminal bus driver with 4 functions, operating at a supply voltage of 5V. It features a propagation delay of 4.1ns and supports surface mount installation. Ideal for industrial applications requiring true output polarity and low enable control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,197 parts In-Stock

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Digiode

USA . 790 parts In-Stock

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790

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AZTECH Wire

Italy . 741 parts In-Stock

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$5.221

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741

$5.221

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Andel Nordic

Denmark . 634 parts In-Stock

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$5.810

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$5.577

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$5.577

634

$5.810

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$5.577

Parana Technologies

USA . 839 parts In-Stock

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$25.175

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$25.826

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839

$25.175

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DigiPath Technology Company

USA . 615 parts In-Stock

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$27.720

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615

$27.720

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ChromeModa Solutions

Germany . 1,736 parts In-Stock

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$28.286

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$23.195

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IDEA Electronic Components Group

UK . 1,551 parts In-Stock

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$28.286

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$26.872

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$25.457

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1,551

$28.286

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$25.457

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One Stop Electronics

USA . 1,108 parts In-Stock

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$42.000

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Corphita

USA . 3,201 parts In-Stock

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Native Components

USA . 843 parts In-Stock

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Northwest PG Solutions

USA . 37 parts In-Stock

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Overview

Unlock the power of seamless data transfer with the FCT162244CTPACTE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their Bus Driver & Transceivers. This versatile product is perfect for a wide range of applications, providing customers with fast propagation delay, low power consumption, and high performance. Say goodbye to connectivity issues and hello to smooth operations with the FCT162244CTPACTE4. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside the package.

Propagation Delay At Nominal Supply: 4.1 ns

Low propagation delay ensures fast data transfer and efficient operation.

Surface Mount: YES

Easily mountable on circuit boards, saves space and simplifies installation.

No. of Functions: 4

Multiple functions in one component streamline design and reduce component count.

Nominal Supply Voltage / Vsup (V): 5

Operates at standard 5V supply voltage for compatibility with various systems.

Maximum I (ol): 24 Amp

High output current capability allows driving loads with ease.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in different environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers FCT162244CTPACTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

4.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

FCT162244CTPACTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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