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FCT162373ATPACTG4

Texas Instruments

FCT162373ATPACTG4 by Texas Instruments

FCT162373ATPACTG4 by Texas Instruments is a bus driver & transceiver with 8 bits, 2 functions, and 48 terminals. It has a propagation delay of 5.2 ns at nominal voltage of 5V, making it ideal for industrial applications requiring fast signal transmission in tight spaces. With a small outline package style and surface mount capability, this CMOS technology device offers efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,645 parts In-Stock

1+ parts

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Digiode

USA . 3,479 parts In-Stock

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3,479

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Distributors (Availability)

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Andel Nordic

Denmark . 2,739 parts In-Stock

1+ parts

$7.924

100+ parts

-

1k+ parts

$7.607

10k+ parts

$7.607

2,739

$7.924

-

$7.607

$7.607

AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$12.396

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405

$12.396

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One Stop Electronics

USA . 809 parts In-Stock

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$15.000

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809

$15.000

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Parana Technologies

USA . 803 parts In-Stock

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$24.157

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$24.810

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803

$24.157

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$24.810

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DigiPath Technology Company

USA . 861 parts In-Stock

1+ parts

$26.600

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861

$26.600

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IDEA Electronic Components Group

UK . 469 parts In-Stock

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$27.143

100+ parts

$25.786

1k+ parts

$24.429

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469

$27.143

$25.786

$24.429

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ChromeModa Solutions

Germany . 127 parts In-Stock

1+ parts

$27.143

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$22.257

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127

$27.143

$22.257

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Native Components

USA . 612 parts In-Stock

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$132.612

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$127.308

612

$132.612

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$127.308

Northwest PG Solutions

USA . 2,356 parts In-Stock

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$145.873

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2,356

$145.873

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Corphita

USA . 3,462 parts In-Stock

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Overview

Enhance your electronic designs with the FCT162373ATPACTG4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver is ideal for various applications, offering 2 functions, 8 bits, and a 3-STATE output with series resistor. With a small outline and thin profile package, this product ensures efficient performance with a propagation delay of 5.2 ns. Trust Texas Instruments to deliver cutting-edge technology that meets industrial standards, providing customers with unmatched value and benefits for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast communication between components, making this product suitable for high-speed bus driver applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, saving cost and board space.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to align and mount the component on the PCB, simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and reduces the need for additional voltage conversion circuitry.

Power Supplies (V): 5

Operating at 5V supply voltage ensures reliable performance and compatibility with various devices.

No. of Terminals: 48

Having a high number of terminals allows for multiple connection options and flexibility in circuit design.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistor provides flexibility in controlling the output signal and helps in reducing signal reflections and noise.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers FCT162373ATPACTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

FCT162373ATPACTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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