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FCT162373ATPACTE4

Texas Instruments

FCT162373ATPACTE4 by Texas Instruments

FCT162373ATPACTE4 by Texas Instruments is a Bus Driver & Transceiver with 8 bits, 2 functions, and 48 terminals. It operates at a supply voltage of 5V, has a propagation delay of 5.2ns, and features a max operating temperature of 85°C. Ideal for industrial applications requiring CMOS technology in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,630 parts In-Stock

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6,630

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Digiode

USA . 673 parts In-Stock

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673

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Distributors (Availability)

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AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$6.824

100+ parts

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472

$6.824

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One Stop Electronics

USA . 1,069 parts In-Stock

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$8.000

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1,069

$8.000

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Andel Nordic

Denmark . 3,919 parts In-Stock

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$8.262

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$7.932

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$7.932

3,919

$8.262

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$7.932

$7.932

Parana Technologies

USA . 867 parts In-Stock

1+ parts

$24.573

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$25.238

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867

$24.573

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$25.238

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DigiPath Technology Company

USA . 789 parts In-Stock

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$27.058

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789

$27.058

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ChromeModa Solutions

Germany . 6,328 parts In-Stock

1+ parts

$27.610

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$22.640

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6,328

$27.610

$22.640

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IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$27.610

100+ parts

$26.230

1k+ parts

$24.849

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1,584

$27.610

$26.230

$24.849

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Native Components

USA . 460 parts In-Stock

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$40.451

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$38.833

460

$40.451

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$38.833

Northwest PG Solutions

USA . 2,278 parts In-Stock

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$44.496

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2,278

$44.496

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Corphita

USA . 4,689 parts In-Stock

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4,689

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Overview

Unlock seamless communication and data transmission with the FCT162373ATPACTE4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality in the Bus Driver & Transceivers category. This versatile product offers fast propagation delay, high power supply, and a compact design for efficient use. Whether you're designing industrial machinery or consumer electronics, this innovative solution ensures reliable performance and connectivity. Elevate your projects with the trusted brand and advanced technology that Texas Instruments provides, setting you apart in the competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring the longevity of the product.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, simplifying the overall design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems and applications.

Load Capacitance (CL): 50 pF

Having a low load capacitance allows for efficient signal transmission with minimal distortion or interference.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable and reliable operation of the product.

No. of Terminals: 48

Having a higher number of terminals provides greater connectivity options and flexibility in circuit design.

Maximum I (ol): 24 Amp

High output current capability of 24A ensures the product can drive heavy loads without overheating or performance degradation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance allows the product to operate reliably in harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers FCT162373ATPACTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

FCT162373ATPACTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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