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FCT162244CTPACTG4

Texas Instruments

FCT162244CTPACTG4 by Texas Instruments

FCT162244CTPACTG4 by Texas Instruments is a 48-terminal bus driver with 4 functions, operating at a supply voltage of 5V. It features a propagation delay of 4.1ns and can handle a max output current of 24A. This CMOS technology device is ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,495 parts In-Stock

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7,495

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Digiode

USA . 4,678 parts In-Stock

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4,678

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Distributors (Availability)

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AZTECH Wire

Italy . 366 parts In-Stock

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$18.320

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366

$18.320

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Parana Technologies

USA . 976 parts In-Stock

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$23.999

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$24.655

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976

$23.999

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$24.655

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ChromeModa Solutions

Germany . 4,988 parts In-Stock

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$26.965

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$22.111

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

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$26.965

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$25.617

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$24.268

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1,543

$26.965

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$24.268

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One Stop Electronics

USA . 605 parts In-Stock

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$38.000

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605

$38.000

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Native Components

USA . 932 parts In-Stock

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$65.770

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$63.139

932

$65.770

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$63.139

Northwest PG Solutions

USA . 1,391 parts In-Stock

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$72.347

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Corphita

USA . 4,009 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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DigiPath Technology Company

USA . 1,412 parts In-Stock

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$24.312

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Overview

Experience the superior quality and reliability of Texas Instruments with the FCT162244CTPACTG4 Bus Driver & Transceivers. This versatile component is ideal for a wide range of applications, providing efficient signal transmission with minimal propagation delay. With a compact design and industry-leading technology, this product offers exceptional value and performance for your electronic projects. Trust in Texas Instruments to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easier to handle and less prone to damage during installation and operation.

Propagation Delay At Nominal Supply: 4.1 ns

With a low propagation delay, this product ensures fast and efficient data transmission, making it suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable makes the product suitable for compact PCB designs, saving space and allowing for efficient placement on the board.

No. of Functions: 4

Having 4 functions in a single device increases functionality and versatility, allowing for more capabilities within a limited space.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes the product compatible with a wide range of systems and power sources, ensuring easy integration.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation and reliable performance of the product, reducing the risk of voltage fluctuations impacting functionality.

No. of Terminals: 48

A higher number of terminals allow for more connections and options for interfacing with other components, increasing the flexibility and compatibility of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package makes it easy to integrate into space-constrained environments, ideal for applications where size and weight are critical factors.

Maximum I (ol): 24 Amp

With a high output current capability, this product can drive larger loads or multiple devices without overheating or performance degradation.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor configuration allows for high impedance when disabled, reducing power consumption and minimizing signal interference in multi-device setups.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85°C ensures reliable operation in harsh environments and extreme conditions, making the product suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers FCT162244CTPACTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

4.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

FCT162244CTPACTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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