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FCT162240CTPACTE4

Texas Instruments

FCT162240CTPACTE4 by Texas Instruments

FCT162240CTPACTE4 by Texas Instruments is a 48-terminal bus driver with 4 functions and a propagation delay of 4.3 ns, suitable for industrial applications. It operates at temperatures ranging from -40 to 85 °C and has a max supply voltage of 5.5 V, making it ideal for various electronic systems requiring fast signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,252 parts In-Stock

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5,252

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Digiode

USA . 2,680 parts In-Stock

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2,680

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Distributors (Availability)

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Andel Nordic

Denmark . 585 parts In-Stock

1+ parts

$2.122

100+ parts

-

1k+ parts

$2.037

10k+ parts

$2.037

585

$2.122

-

$2.037

$2.037

AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$9.094

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737

$9.094

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Native Components

USA . 559 parts In-Stock

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$11.703

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559

$11.703

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Northwest PG Solutions

USA . 1,155 parts In-Stock

1+ parts

$12.874

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$11.586

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1,155

$12.874

$11.586

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Parana Technologies

USA . 1,808 parts In-Stock

1+ parts

$21.585

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$21.981

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1,808

$21.585

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$21.981

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DigiPath Technology Company

USA . 511 parts In-Stock

1+ parts

$23.768

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511

$23.768

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IDEA Electronic Components Group

UK . 1,167 parts In-Stock

1+ parts

$24.253

100+ parts

$23.040

1k+ parts

$21.828

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1,167

$24.253

$23.040

$21.828

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ChromeModa Solutions

Germany . 930 parts In-Stock

1+ parts

$24.253

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$19.887

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930

$24.253

$19.887

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One Stop Electronics

USA . 862 parts In-Stock

1+ parts

$47.000

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862

$47.000

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Corphita

USA . 2,108 parts In-Stock

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Overview

Enhance your electronic projects with the FCT162240CTPACTE4 by Texas Instruments, a top-tier manufacturer known for delivering premium quality components. This bus driver & transceiver offers exceptional reliability and performance, making it ideal for various applications. With its innovative design and advanced features, this product provides unmatched value, benefits, and advantages to customers looking to streamline their projects and achieve superior results. Choose Texas Instruments for superior quality and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceivers.

Propagation Delay At Nominal Supply: 4.3 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate this product onto circuit boards, saving space and reducing assembly time.

No. of Functions: 4

Having multiple functions in one component simplifies circuit design and reduces overall system complexity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources.

No. of Terminals: 48

With a high number of terminals, this product offers versatile connectivity options for various input and output configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver and transceiver efficient and reliable in operation.

Technical Specifications

Bus Driver & Transceivers FCT162240CTPACTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

4.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

FCT162240CTPACTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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