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FCT162245ATPACTE4

Texas Instruments

FCT162245ATPACTE4 by Texas Instruments

FCT162245ATPACTE4 by Texas Instruments is a bus driver with 8 bits, 2 functions, and 48 terminals. It operates at a supply voltage of 5V with a propagation delay of 4.5ns, suitable for industrial applications requiring bidirectional control in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,910 parts In-Stock

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4,910

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Vyrian

USA . 3,524 parts In-Stock

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3,524

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Distributors (Availability)

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Andel Nordic

Denmark . 5,219 parts In-Stock

1+ parts

$5.625

100+ parts

-

1k+ parts

$5.400

10k+ parts

$5.400

5,219

$5.625

-

$5.400

$5.400

AZTECH Wire

Italy . 319 parts In-Stock

1+ parts

$5.916

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319

$5.916

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Parana Technologies

USA . 951 parts In-Stock

1+ parts

$15.919

100+ parts

$1,478.361

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$14.327

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-

951

$15.919

$1,478.361

$14.327

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DigiPath Technology Company

USA . 1,516 parts In-Stock

1+ parts

$17.529

100+ parts

$16.127

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1,516

$17.529

$16.127

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IDEA Electronic Components Group

UK . 2,303 parts In-Stock

1+ parts

$17.887

100+ parts

$16.993

1k+ parts

$16.098

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2,303

$17.887

$16.993

$16.098

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ChromeModa Solutions

Germany . 700 parts In-Stock

1+ parts

$17.887

100+ parts

$14.667

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700

$17.887

$14.667

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One Stop Electronics

USA . 1,091 parts In-Stock

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$42.000

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1,091

$42.000

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Native Components

USA . 222 parts In-Stock

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$117.440

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$112.742

222

$117.440

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$112.742

Northwest PG Solutions

USA . 1,173 parts In-Stock

1+ parts

$129.184

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1,173

$129.184

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Corphita

USA . 3,312 parts In-Stock

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Overview

Enhance your electronic designs with the FCT162245ATPACTE4 by Texas Instruments, a top-tier manufacturer known for quality and innovation. As a leading product in the Bus Driver & Transceivers category, this versatile component offers top-notch performance and reliability. With its fast propagation delay, low power consumption, and compact design, this bus driver is ideal for a wide range of applications. Elevate your projects with the superior value and functionality that this Texas Instruments product provides, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, enhancing the overall reliability of the product.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with common systems and power sources.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data transmission and processing tasks effectively.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with series resistor enables flexible control over output signals, enhancing the versatility of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers FCT162245ATPACTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

FCT162245ATPACTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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